ZHCSU26A December 2023 – February 2024 ESDS552
PRODUCTION DATA
| THERMAL METRIC(1) | ESDS552 | UNIT | |
|---|---|---|---|
| DBZ (SOT-23) | |||
| 3 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 244.1 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 107.4 | °C/W |
| RθJB | Junction-to-board thermal resistance | 85.5 | °C/W |
| ΨJT | Junction-to-top characterization parameter | 12.8 | °C/W |
| ΨJB | Junction-to-board characterization parameter | 84.8 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | °C/W |