ZHCSIH2C May 2018 – February 2024 ESDS311 , ESDS312 , ESDS314
PRODUCTION DATA
| THERMAL METRIC (1) |
ESDS311 |
ESDS312 | ESDS314 | UNIT | |
|---|---|---|---|---|---|
|
DYF (SOD323) |
DBV (SOT-23) | DBV (SOT-23) | |||
|
2 PINS |
5 PINS | 5 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 739.2 | 163.9 | 127.6 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 287.7 | 113.4 | 78.9 | °C/W |
| RθJB | Junction-to-board thermal resistance | 605.5 | 76.9 | 43.9 | °C/W |
| ΨJT | Junction-to-top characterization parameter | 118.4 | 59.8 | 24.5 | °C/W |
| ΨJB | Junction-to-board characterization parameter | 591.1 | 76.8 | 43.7 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | N/A | N/A | °C/W |