ZHCSIS5B May 2018 – January 2024 ESDS302 , ESDS304
PRODUCTION DATA
請(qǐng)參考 PDF 數(shù)據(jù)表獲取器件具體的封裝圖。
| THERMAL METRIC(1) | ESDS302 | ESDS304 | UNIT | |
|---|---|---|---|---|
| DBV (SOT-23) | DBV (SOT-23) | |||
| 5 PINS | 5 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 176.2 | 133.5 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 125.7 | 85.1 | °C/W |
| RθJB | Junction-to-board thermal resistance | 88.4 | 49.4 | °C/W |
| ΨJT | Junction-to-top characterization parameter | 71.4 | 30.1 | °C/W |
| ΨJB | Junction-to-board characterization parameter | 88.2 | 49.2 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | N/A | °C/W |