ZHCSQM5B May 2022 – November 2022 ESD752 , ESD762
PRODMIX
| THERMAL METRIC(1) | ESD752 | ESD762 | UNIT | ||
|---|---|---|---|---|---|
| DBZ (SOT-23) | DCK (SOT-323 / SC-70) | DBZ (SOT-23) | |||
| 3 PINS | 3 PINS | 3 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 291.5 | 283.0 | 325.3 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 147.1 | 164.1 | 178.8 | °C/W |
| RθJB | Junction-to-board thermal resistance | 131.1 | 105.1 | 165.5 | °C/W |
| ΨJT | Junction-to-top characterization parameter | 32.0 | 67.1 | 52.4 | °C/W |
| ΨJB | Junction-to-board characterization parameter | 130.2 | 104.4 | 164.4 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | N/A | N/A | °C/W |