ZHCSCL3 JUNE 2014 DS90UH925AQ-Q1
PRODUCTION DATA.
- 1 特性
- 2 應(yīng)用范圍
- 3 說明
- 4 簡化電路原理圖
- 5 修訂歷史記錄
- 6 Pin Configuration and Functions
-
7 Specifications
- 7.1 Absolute Maximum Ratings
- 7.2 Handling Ratings
- 7.3 Recommended Operating Conditions
- 7.4 Thermal Information
- 7.5 DC Electrical Characteristics
- 7.6 AC Electrical Characteristics
- 7.7 Recommended Timing for the Serial Control Bus
- 7.8 DC and AC Serial Control Bus Characteristics
- 7.9 AC Timing Diagrams and Test Circuits
- 7.10 Switching Characteristics
- 7.11 Typical Characteristics
-
8 Detailed Description
- 8.1
Overview
- 8.1.1 Functional Block Diagram
- 8.1.2
Feature Description
- 8.1.2.1 High Speed Forward Channel Data Transfer
- 8.1.2.2 Low Speed Back Channel Data Transfer
- 8.1.2.3 Common Mode Filter Pin (CMF)
- 8.1.2.4 Video Control Signal Filter
- 8.1.2.5 Backward Compatible Mode
- 8.1.2.6 EMI Reduction Features
- 8.1.2.7 LVCMOS VDDIO Option
- 8.1.2.8 Power Down (PDB)
- 8.1.2.9 Remote Auto Power Down Mode
- 8.1.2.10 Input PCLK Loss Detect
- 8.1.2.11 Serial Link Fault Detect
- 8.1.2.12 Pixel Clock Edge Select (RFB)
- 8.1.2.13 Low Frequency Optimization (LFMODE)
- 8.1.2.14 Interrupt Pins - Funtional Description and Usage (INTB, REM_INTB)
- 8.1.2.15 GPIO[3:0] and GPO_REG[7:4]
- 8.1.2.16 I2S Transmitting
- 8.1.3 Built In Self Test (BIST)
- 8.1.4 Internal Pattern Generation
- 8.1.5 Change Summary from DS90UH925Q
- 8.2 Device Functional Modes
- 8.3 Programming
- 8.1
Overview
- 9 Application and Implementation
- 10Power Supply Recommendations
- 11Layout
- 12器件和文檔支持
- 13機(jī)械封裝和可訂購信息
封裝選項
機(jī)械數(shù)據(jù) (封裝 | 引腳)
- RHS|48
散熱焊盤機(jī)械數(shù)據(jù) (封裝 | 引腳)
- RHS|48
訂購信息
12 器件和文檔支持
12.1 Trademarks
All other trademarks are the property of their respective owners.
12.2 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.