ZHCSD34B November 2014 – August 2019 DS90UB949-Q1
PRODUCTION DATA.
| THERMAL METRIC(1) | DS90UB949-Q1 | UNIT | |
|---|---|---|---|
| RGC (VQFN) | |||
| 64 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 25.8 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 11.4 | °C/W |
| RθJB | Junction-to-board thermal resistance | 5.1 | °C/W |
| ψJT | Junction-to-top characterization parameter | 0.2 | °C/W |
| ψJB | Junction-to-board characterization parameter | 5.1 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | 0.8 | °C/W |