ZHCSJH7 March 2019 DS90UB940N-Q1
PRODUCTION DATA.
| THERMAL METRIC(1) | DS90UB940N-Q1 | UNIT | |
|---|---|---|---|
| NKD (WQFN) | |||
| 64 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 24.8 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 6.2 | °C/W |
| RθJB | Junction-to-board thermal resistance | 3.6 | °C/W |
| ψJT | Junction-to-top characterization parameter | 0.1 | °C/W |
| ψJB | Junction-to-board characterization parameter | 3.6 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | 0.6 | °C/W |