Table 14. Design Parameters

9.2.2.1 PCB Layout and Power System Considerations

Circuit board layout and stack-up for the LVDS serializer and deserializer devices should be designed to provide low-noise power to the device. Good layout practice will also separate high frequency or high-level inputs and outputs to minimize unwanted stray noise, feedback and interference. Power system performance may be greatly improved by using thin dielectrics (2 to 4 mil) for power / ground sandwiches. This arrangement utilizes the plane capacitance for the PCB power system and has low-inductance, which has proven effectiveness especially at high frequencies, and makes the value and placement of external bypass capacitors less critical. External bypass capacitors should include both RF ceramic and tantalum electrolytic types. RF capacitors may use values in the range of 0.01 μF to 10 μF. Tantalum capacitors may be in the 2.2 μF to 10 μF range. The voltage rating of the tantalum capacitors should be at least 5X the power supply voltage being used.

MLCC surface mount capacitors are recommended due to their smaller parasitic properties. When using multiple capacitors per supply pin, locate the smaller value closer to the pin. A large bulk capacitor is recommended at the point of power entry. This is typically in the 50 μF to 100 μF range and will smooth low frequency switching noise. It is recommended to connect power and ground pins directly to the power and ground planes with bypass capacitors connected to the plane with via on both ends of the capacitor. Connecting power or ground pins to an external bypass capacitor will increase the inductance of the path. A small body size X7R chip capacitor, such as 0603 or 0805, is recommended for external bypass. A small body sized capacitor has less inductance. The user must pay attention to the resonance frequency of these external bypass capacitors, usually in the range of 20MHz-30MHz. To provide effective bypassing, multiple capacitors are often used to achieve low impedance between the supply rails over the frequency of interest. At high frequency, it is also a common practice to use two vias from power and ground pins to the planes, reducing the impedance at high frequency.

Use at least a four layer board with a power and ground plane. Locate LVCMOS signals away from the LVDS lines to prevent coupling from the LVCMOS lines to the LVDS lines. Closely coupled differential lines of 100 Ω are typically recommended for LVDS interconnect. The closely coupled lines help to ensure that coupled noise will appear as common mode and thus is rejected by the receivers. The tightly coupled lines will also radiate less.

At least 32 thermal vias are necessary from the device center DAP to the ground plane. They connect the device ground to the PCB ground plane, as well as conduct heat from the exposed pad of the package to the PCB ground plane. More information on the WQFN style package, including PCB design and manufacturing requirements, is provided in TI Application Note: AN-1187.

9.2.2.2 CML Interconnect Guidelines

See AN-1108 and AN-905 for full details.

• Use 100Ω coupled differential pairs
• Use the S/2S/3S rule in spacings
  • S = space between the pair
  • 2S = space between pairs
  • 3S = space to LVCMOS signal
• Minimize the number of Vias
• Use differential connectors when operating above 500Mbps line speed
• Maintain balance of the traces
• Minimize skew within the pair
• Terminate as close to the TX outputs and RX inputs as possible

Additional general guidance can be found in the LVDS Owner’s Manual - available in PDF format from the Texas Instruments web site at: SNLA187