ZHCSKE7B February 2017 – October 2019 DS250DF210
PRODUCTION DATA.
- 1 特性
- 2 應(yīng)用
- 3 說(shuō)明
- 4 修訂歷史記錄
- 5 說(shuō)明 （續(xù)）
- 6 Pin Configuration and Functions
-
7 Specifications
- 7.1 Absolute Maximum Ratings
- 7.2 ESD Ratings
- 7.3 Recommended Operating Conditions
- 7.4 Thermal Information
- 7.5 Electrical Characteristics
- 7.6 Timing Requirements, Retimer Jitter Specifications
- 7.7 Timing Requirements, Retimer Specifications
- 7.8 Timing Requirements, Recommended Calibration Clock Specifications
- 7.9 Recommended SMBus Switching Characteristics (Slave Mode)
- 7.10 Recommended SMBus Switching Characteristics (Master Mode)
- 7.11 Typical Characteristics
-
8 Detailed Description
- 8.1 Overview
- 8.2 Functional Block Diagram
- 8.3
Feature Description
- 8.3.1 Device Data Path Operation
- 8.3.2 Signal Detect
- 8.3.3 Continuous Time Linear Equalizer (CTLE)
- 8.3.4 Variable Gain Amplifier (VGA)
- 8.3.5 Cross-Point Switch
- 8.3.6 Decision Feedback Equalizer (DFE)
- 8.3.7 Clock and Data Recovery (CDR)
- 8.3.8 Calibration Clock
- 8.3.9 Differential Driver With FIR Filter
- 8.3.10 Debug Features
- 8.3.11 Interrupt Signals
- 8.4 Device Functional Modes
- 8.5 Programming
- 8.6 Register Maps
- 9 Application and Implementation
- 10Power Supply Recommendations
- 11Layout
- 12器件和文檔支持
- 13機(jī)械、封裝和可訂購(gòu)信息
封裝選項(xiàng)
機(jī)械數(shù)據(jù) (封裝 | 引腳)
- ABM|101
散熱焊盤機(jī)械數(shù)據(jù) (封裝 | 引腳)
訂購(gòu)信息
6 Pin Configuration and Functions
ABM Package
101-Pin fcBGA, 0.5mm BGA pitch
Top View
Pin Functions
| PIN | TYPE | INTERNAL
PULLUP/ PULLDOWN |
DESCRIPTION | |
|---|---|---|---|---|
| NAME | NO. | |||
| HIGH-SPEED DIFFERENTIAL I/Os | ||||
| RX0N | A10 | Input | None | Inverting and noninverting differential inputs to the equalizer. An on-chip 100-Ω termination resistor connects RXP to RXN. These inputs must be AC-coupled.(1) |
| RX0P | A11 | Input | None | |
| RX1N | A7 | Input | None | Inverting and noninverting differential inputs to the equalizer. An on-chip 100-Ω termination resistor connects RXP to RXN. These inputs must be AC-coupled.(1) |
| RX1P | A8 | Input | None | |
| TX0N | L10 | Output | None | Inverting and noninverting 50-Ω driver outputs. Compatible with AC-coupled differential inputs. These outputs must be AC-coupled.(1) |
| TX0P | L11 | Output | None | |
| TX1N | L7 | Output | None | Inverting and noninverting 50-Ω driver outputs. Compatible with AC-coupled differential inputs. These outputs must be AC-coupled.(1) |
| TX1P | L8 | Output | None | |
| CALIBRATION CLOCK PINS | ||||
| CAL_CLK_IN | F1 | Input, 2.5-V CMOS | Weak pulldown | 25-MHz (±100 PPM) 2.5-V single-ended clock from external oscillator. No stringent phase noise or jitter requirements on this clock. Used to calibrate VCO frequency range. |
| CAL_CLK_
OUT |
F11 | Output, 2.5-V CMOS | None | 2.5-V buffered replica of calibration clock input (pin E1) for connecting multiple devices in a daisy-chained fashion. |
| SYSTEM MANAGEMENT BUS (SMBus) PINS | ||||
| ADDR0 | D11 | Input, 4-level | None | 4-level strap pins used to set the SMBus address of the device. The pin state is read on power up. The multi-level nature of these pins allows for 16 unique device addresses. The four strap options include:
0: 1 kΩ to GND R: 20 kΩ to GND F: Float 1: 1 kΩ to VDD Refer to Device SMBus Address for more details. |
| ADDR1 | D1 | Input, 4-level | None | |
| EN_SMB | G1 | Input, 4-level | None | Four-level, 2.5-V input used to select between SMBus master mode (float) and SMBus slave mode (high). The four defined levels are:
0: 1 kΩ to GND - RESERVED R: 20 kΩ to GND - RESERVED, TI test mode F: Float - SMBus Master Mode 1: 1 kΩ to VDD - SMBus Slave Mode |
| SDA | G11 | I/O, 3.3-V LVCMOS, Open-Drain | None | SMBus data input / open-drain output. External 2-kΩ to 5-kΩ pullup resistor is required as per SMBus interface standard. This pin is 3.3-V LVCMOS tolerant. |
| SDC | H11 | I/O, 3.3-V LVCMOS, Open-Drain | None | SMBus clock input / open-drain clock output. External 2-kΩ to 5-kΩ pullup resistor is required as per SMBus interface standard. This pin is 3.3-V LVCMOS tolerant. |
| SMBus MASTER MODE PINS | ||||
| ALL_DONE_N | E1 | Output, LVCMOS | None | Indicates the completion of a valid EEPROM register load operation when in SMBus Master Mode (EN_SMB=Float):
High = External EEPROM load failed or incomplete Low = External EEPROM load successful and complete When in SMBus slave mode (EN_SMB=1), this output reflects the status of the READ_EN_N input. |
| READ_EN_N | E11 | Input, LVCMOS | Weak pullup | SMBus Master Mode (EN_SMB=Float): When asserted low, initiates the SMBus master mode EEPROM read function. Once EEPROM read is complete (indicated by assertion of ALL_DONE_N low), this pin can be held low for normal device operation.
SMBus Slave Mode (EN_SMB=1): When asserted low, this causes the device to be held in reset (I2C state machine reset and register reset). This pin must be pulled high or left floating for normal operation in SMBus Slave Mode. |
| MISCELLANEOUS PINS | ||||
| INT_N | H1 | Output, LVCMOS, Open-Drain | None | Open-drain 3.3-V tolerant active-low interrupt output. It pulls low when an interrupt occurs. The events which trigger an interrupt are programmable through SMBus registers. INT_N can be connected in a wired-OR fashion with other device's interrupt pin. A single pullup resistor in the 2-kΩ to 5-kΩ range is adequate for the entire INT_N net. |
| NC | A1, A2, A4, A5, L1, L2, L4, L5 | No connect on board | None | Unused pins. No connect on the PCB. |
| TEST0 | D10 | Input, LVCMOS | Weak pullup | Reserved TI test pins. During normal (non-test-mode) operation, these pins are configured as inputs and therefore they are not affected by the presence of a signal. These pins may be left floating, tied to GND, or connected to a 2.5-V (maximum) output. |
| TEST1 | D2 | Input, LVCMOS | Weak pullup | |
| TEST2 | E10 | Input, LVCMOS | Weak pullup | |
| TEST3 | E2 | Input, LVCMOS | Weak pullup | |
| TEST4 | H10 | Input, LVCMOS | Weak pullup | |
| TEST5 | H2 | Input, LVCMOS | Weak pullup | |
| POWER | ||||
| GND | A3, A6, A9, B1, B2, B3, B4, B5, B6, B7, B8, B9, B10, B11, C1, C6, C11, D6, E3, E5, E7, E9, F3, F4, F5, F6, F7, F8, F9, G2, G3, G5, G7, G9, G10, H6, J1, J6, J11, K1, K2, K3, K4, K5, K6, K7, K8, K9, K10, K11, L3, L6, L9 | Power | None | Ground reference. The GND pins on this device must be connected through a low-resistance path to the board GND plane. |
| VDD | C3, C9, D3, D4, D5, D7, D8, D9, H3, H4, H5, H7, H8, H9, J3, J9 | Power | None | Power supply, VDD = 2.5 V ±5%. TI recommends connecting at least six de-coupling capacitors between the DS250DF210’s VDD plane and GND as close to the DS250DF210 as possible. For example, four 0.1-μF capacitors and two 1-μF capacitors directly beneath the device or as close to the VDD pins as possible. The VDD pins on this device must be connected through a low-resistance path to the board VDD plane. |
(1) High-speed pins do not have short-circuit protection. High-speed pins must be AC-coupled.