ZHCSKE7B February 2017 – October 2019 DS250DF210
PRODUCTION DATA.
| THERMAL METRIC(2) | CONDITIONS/ASSUMPTIONS(1) | DS250DF210 | UNIT | |
|---|---|---|---|---|
| ABM (FC/CSP) | ||||
| 101 PINS | ||||
| RθJA | Junction-to-ambient thermal resistance | 4-Layer JEDEC Board | 34.2 | °C/W |
| 10-Layer 8-in x 6-in Board | 16.7 | |||
| 20-Layer 8-in x 6-in Board | 15.6 | |||
| 30-Layer 8-in x 6-in Board | 14.6 | |||
| RθJC(top) | Junction-to-case (top) thermal resistance | 4-Layer JEDEC Board | 7.8 | °C/W |
| RθJB | Junction-to-board thermal resistance | 4-Layer JEDEC Board | 13.7 | °C/W |
| ΨJT | Junction-to-top characterization parameter | 4-Layer JEDEC Board | 0.004 | °C/W |
| 10-Layer 8-in x 6-in Board | 0.004 | |||
| 20-Layer 8-in x 6-in Board | 0.004 | |||
| 30-Layer 8-in x 6-in Board | 0.004 | |||
| ΨJB | Junction-to-board characterization parameter | 4-Layer JEDEC Board | 13.0 | °C/W |
| 10-Layer 8-in x 6-in Board | 11.7 | |||
| 20-Layer 8-in x 6-in Board | 11.5 | |||
| 30-Layer 8-in x 6-in Board | 11.3 | |||