SLVSET1 August 2018 DRV8873
PRODUCTION DATA.
| THERMAL METRIC(1) | DRV8873-Q1 | UNIT | |
|---|---|---|---|
| PWP (HTSSOP) | |||
| 24 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 27.8 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 18.8 | °C/W |
| RθJB | Junction-to-board thermal resistance | 5.1 | °C/W |
| ΨJT | Junction-to-top characterization parameter | 0.3 | °C/W |
| ΨJB | Junction-to-board characterization parameter | 5.2 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | 1.0 | °C/W |