ZHCSQL7F May 2010 – May 2022 DRV8312 , DRV8332
PRODUCTION DATA
| PARAMETER | DRV8312 | DRV8332 |
|---|---|---|
| RθJC, junction-to-case (power pad / heat slug) thermal resistance | 1.1 °C/W | 0.9 °C/W |
| RθJA, junction-to-ambient thermal resistance | 25 °C/W | This device is not intended to be used without a heatsink. Therefore, RθJA is not specified. See the Thermal Information section. |
| Exposed power pad / heat slug area | 34 mm2 | 80 mm2 |