ZHCSMX4D September 2020 – March 2022 DRV8300
PRODUCTION DATA
| THERMAL METRIC(1) | DRV8300 | UNIT | ||
|---|---|---|---|---|
| PW (TSSOP) | RGE (VQFN) | |||
| 20 PINS | 24 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 97.4 | 49.3 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 38.3 | 42.5 | °C/W |
| RθJB | Junction-to-board thermal resistance | 48.8 | 26.5 | °C/W |
| ΨJT | Junction-to-top characterization parameter | 4.3 | 2.2 | °C/W |
| ΨJB | Junction-to-board characterization parameter | 48.4 | 26.4 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | 11.5 | °C/W |