ZHCSPF5 April 2022 DRV8300-Q1
PRODUCTION DATA
| THERMAL METRIC (1) | DRV8300-Q1 | UNIT | |
|---|---|---|---|
| PW (TSSOP) | |||
| 20 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 97.4 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 38.3 | °C/W |
| RθJB | Junction-to-board thermal resistance | 48.8 | °C/W |
| ΨJT | Junction-to-top characterization parameter | 4.3 | °C/W |
| ΨJB | Junction-to-board characterization parameter | 48.4 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | °C/W |