ZHCSKV7A November   2020  – July 2022 DLP500YX

PRODUCTION DATA  

1. 1 特性
2. 2 應用
3. 3 說明
4. 4 Revision History
5. 5 Pin Configuration and Functions
6. 6 Specifications
   1. 6.1  Absolute Maximum Ratings
   2. 6.2  Storage Conditions
   3. 6.3  ESD Ratings
   4. 6.4  Recommended Operating Conditions
   5. 6.5  Thermal Information
   6. 6.6  Electrical Characteristics
   7. 6.7  Capacitance at Recommended Operating Conditions
   8. 6.8  Timing Requirements
   9. 6.9  Typical Characteristics
   10. 6.10 System Mounting Interface Loads
   11. 6.11 Micromirror Array Physical Characteristics
   12. 6.12 Micromirror Array Optical Characteristics
   13. 6.13 Window Characteristics
   14. 6.14 Chipset Component Usage Specification
7. 7 Detailed Description
   1. 7.1 Overview
   2. 7.2 Functional Block Diagram
   3. 7.3 Feature Description
      1. 7.3.1 Power Interface
      2. 7.3.2 Timing
   4. 7.4 Device Functional Modes
   5. 7.5 Optical Interface and System Image Quality Considerations
      1. 7.5.1 Numerical Aperture and Stray Light Control
      2. 7.5.2 Pupil Match
      3. 7.5.3 Illumination Overfill
   6. 7.6 Micromirror Array Temperature Calculation
      1. 7.6.1 Micromirror Array Temperature Calculation using Illumination Power Density
      2. 7.6.2 Micromirror Array Temperature Calculation using Total Illumination Power
      3. 7.6.3 Micromirror Array Temperature Calculation using Screen Lumens
   7. 7.7 Micromirror Landed-On/Landed-Off Duty Cycle
      1. 7.7.1 Definition of Micromirror Landed-On/Landed-Off Duty Cycle
      2. 7.7.2 Landed Duty Cycle and Useful Life of the DMD
      3. 7.7.3 Landed Duty Cycle and Operational DMD Temperature
      4. 7.7.4 Estimating the Long-Term Average Landed Duty Cycle of a Product or Application
8. 8 Application and Implementation
   1. 8.1 Application Information
   2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
   3. 8.3 DMD Die Temperature Sensing
9. 9 Power Supply Recommendations
   1. 9.1 DMD Power Supply Power-Up Procedure
   2. 9.2 DMD Power Supply Power-Down Procedure
   3. 9.3 Restrictions on Hot Plugging and Hot Swapping
      1. 9.3.1 No Hot Plugging
      2. 9.3.2 No Hot Swapping
      3. 9.3.3 Intermittent or Voltage Power Spike Avoidance
10. 10Layout
    1. 10.1 Layout Guidelines
       1. 10.1.1 Critical Signal Guidelines
       2. 10.1.2 Power Connection Guidelines
       3. 10.1.3 Noise Coupling Avoidance
    2. 10.2 Layout Example
       1. 10.2.1 Layers
       2. 10.2.2 Impedance Requirements
       3. 10.2.3 Trace Width, Spacing
          1. 10.2.3.1 Voltage Signals
11. 11Device and Documentation Support
    1. 11.1 第三方產(chǎn)品免責聲明
    2. 11.2 Device Support
       1. 11.2.1 Device Nomenclature
       2. 11.2.2 Device Markings
    3. 11.3 Documentation Support
       1. 11.3.1 Related Documentation
    4. 11.4 接收文檔更新通知
    5. 11.5 支持資源
    6. 11.6 Trademarks
    7. 11.7 Electrostatic Discharge Caution
    8. 11.8 術(shù)語表
12. 12Mechanical, Packaging, and Orderable Information