ZHCSJP7I December 2000 – September 2020 DCP010505B , DCP010505DB , DCP010507DB , DCP010512B , DCP010512DB , DCP010515B , DCP010515DB , DCP011512DB , DCP011515DB , DCP012405B , DCP012415DB
PRODUCTION DATA
The basic construction of the DCP01B series of devices is the same as standard integrated circuits. The molded package contains no substrate. The DCP01B series of devices are constructed using an IC, rectifier diodes, and a wound magnetic toroid on a lead frame. Because the package contains no solder, the devices do not require any special printed circuit board (PCB) assembly processing. This architecture results in an isolated DC/DC converter with inherently high reliability.