Due to the high power density of these devices, provide ground planes on the input and output rails.

Figure 10-1 and Figure 10-2 show the schematic for the two DIP through-hole packages, and two SOP surface-mount packages for the DCP family of products which include DCP01B, DCP02, DCV01, DCR01, and DCR02. Figure 10-3 and Figure 10-4 illustrate a printed circuit board (PCB) layout for the schematics.

Including input power and ground planes provides a low-impedance path for the input power. For the output, the COM signal connects via a ground plane, while the connections for the positive and negative voltage outputs conduct via wide traces in order to minimize losses.

The output should be taken from the device using ground and power planes, thereby ensuring minimum losses.

The location of the decoupling capacitors in close proximity to their respective pins ensures low losses due to the effects of stray inductance, thus improving the ripple performance. This location is of particular importance to the input decoupling capacitor, because this capacitor supplies the transient current associated with the fast switching waveforms of the power drive circuits.

Allow the unused SYNC pin, to remain configured as a floating pad. It is advisable to place a guard ring (connected to input ground) or annulus connected around this pin to avoid any noise pick up. When connecting a SYNC pin to one or more SYNC design the linking trace to be short and narrow to avoid stray capacitance. Ensure that no other trace is in close proximity to this trace SYNC trace to decrease the stray capacitance on this pin. The stray capacitance affects the performance of the oscillator.