4 Revision History
Changes from Revision A (January 2017) to Revision B (February 2022)
- 將超薄型封裝要點中的厚度從 0.35mm 更改為 0.36mmGo
- 將超薄型封裝圖片中的厚度從 0.35mm 更新為 0.36mmGo
- Changed ultra-low profile image height from 0.35 mm to 0.36
mm.Go
- Added FemtoFET Surface Mount Guide note.Go
Changes from Revision * (August 2016) to Revision A (January 2017)
- Changed Min Cu RθJA from 90°C/W : to 245°C/W in Figure 5-11
Go
- Added Table 7-1 in the Mechanical Dimensions sectionGo