ZHCSC19C January 2014 – February 2025 CSD25310Q2
PRODUCTION DATA
4.2 Thermal Information
(TA = 25°C unless otherwise stated)
| THERMAL METRIC | MIN | TYP | MAX | UNIT | |
|---|---|---|---|---|---|
| RθJC | Thermal Resistance Junction to Case(1) | 4.5 | °C/W | ||
| RθJA | Thermal Resistance Junction to Ambient(1)(2) | 55 | |||
(1) RθJC is determined with the device mounted on a 1
inch2 (6.45cm2), 2oz. (0.071mm thick) Cu pad on a 1.5
inch × 1.5 inch (3.81cm × 3.81cm), 0.06 inch (1.52mm) thick FR4 PCB.
RθJC is specified by design, whereas RθJA is
determined by the user’s board design.
(2) Device mounted on FR4 material with 1 inch2
(6.45cm2), 2oz. (0.071mm thick) Cu.
|
Max RθJA = 55 when mounted on 1 inch2 (6.45cm2) of 2oz. (0.071mm thick) Cu. |
|
Max RθJA = 215 when mounted on minimum pad area of 2oz. (0.071mm thick) Cu. |