ZHCSBP6G October 2013 – January 2022 CSD23381F4
PRODUCTION DATA
- 1特性
- 2應(yīng)用
- 3說明
- 4Revision History
- 5Specifications
- 6Device and Documentation Support
- 7Mechanical, Packaging, and Orderable Information
封裝選項
請參考 PDF 數(shù)據(jù)表獲取器件具體的封裝圖。
機械數(shù)據(jù) (封裝 | 引腳)
- YJC|3
散熱焊盤機械數(shù)據(jù) (封裝 | 引腳)
訂購信息
6.2 Electrostatic Discharge Caution
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This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. |
| ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. |