ZHCSTF3I June 2007 – August 2024 CDCE913 , CDCEL913
PRODUCTION DATA
| THERMAL METRIC(1)(2)(3) | CDCEx913 | UNIT | ||
|---|---|---|---|---|
| PW [TSSOP] | ||||
| 14 PINS | ||||
| RθJA | Junction-to-ambient thermal resistance | Airflow 0 lfm | 106 | °C/W |
| Airflow 150 lfm | 93 | |||
| Airflow 200 lfm | 92 | |||
| Airflow 250 lfm | 90 | |||
| Airflow 500 lfm | 85 | |||
| RθJC(top) | Junction-to-case (top) thermal resistance | 1.4 | °C/W | |
| RθJB | Junction-to-board thermal resistance | 66 | °C/W | |
| ψJT | Junction-to-top characterization parameter | 1.35 | °C/W | |
| ψJB | Junction-to-board characterization parameter | 61.83 | °C/W | |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | 62 | °C/W | |