ZHCSXX4D December 2004 – April 2025 CD74HC4067-Q1 , CD74HCT4067-Q1
PRODUCTION DATA
請參考 PDF 數據表獲取器件具體的封裝圖。
| THERMAL METRIC (1) | CD74HCx4067 | UNIT | ||||
|---|---|---|---|---|---|---|
| DW (SOIC) | RGY (QFN) | DGS (VSSOP) | PW (TSSOP) | |||
| 24 PINS | 24 PINS | 24 PINS | 24 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 84.8 | 67.1 | 96.8 | 97.4 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 57.0 | 59.2 | 43.4 | 45.0 | °C/W |
| RθJB | Junction-to-board thermal resistance | 59.5 | 45.4 | 58.7 | 62.7 | °C/W |
| ΨJT | Junction-to-top characterization parameter | 29.0 | 9.3 | 3.9 | 5.20 | °C/W |
| ΨJB | Junction-to-board characterization parameter | 59.0 | 45.1 | 58.2 | 62.1 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | 34.7 | N/A | N/A | °C/W |