ZHCSJS2N November 1997 – April 2024 CD54HC4051 , CD54HC4052 , CD54HC4053 , CD54HCT4051 , CD74HC4051 , CD74HC4052 , CD74HC4053 , CD74HCT4051 , CD74HCT4052 , CD74HCT4053
PRODUCTION DATA
- 1
- 1 特性
- 2 應用
- 3 說明
- 4 Pin Configuration and Functions
-
5 Specifications
- 5.1 Absolute Maximum Ratings
- 5.2 ESD Ratings
- 5.3 Thermal Information
- 5.4 Recommended Operating Conditions
- 5.5 Electrical Characteristics: HC Devices
- 5.6 Electrical Characteristics: HCT Devices
- 5.7 Switching Characteristics, VCC = 5V
- 5.8 Switching Characteristics, CL = 50pF
- 5.9 Analog Channel Specifications
- 5.10 Typical Characteristics
- 6 Parameter Measurement Information
- 7 Detailed Description
- 8 Application and Implementation
- 9 Device and Documentation Support
- 10Revision History
- 11Mechanical, Packaging, and Orderable Information
封裝選項
請參考 PDF 數(shù)據(jù)表獲取器件具體的封裝圖。
機械數(shù)據(jù) (封裝 | 引腳)
- PW|16
- NS|16
- N|16
- D|16
散熱焊盤機械數(shù)據(jù) (封裝 | 引腳)
訂購信息
9.5 靜電放電警告
 |
靜電放電 (ESD) 會損壞這個集成電路。德州儀器 (TI) 建議通過適當?shù)念A防措施處理所有集成電路。如果不遵守正確的處理和安裝程序，可能會損壞集成電路。 |
| ESD 的損壞小至導致微小的性能降級，大至整個器件故障。精密的集成電路可能更容易受到損壞，這是因為非常細微的參數(shù)更改都可能會導致器件與其發(fā)布的規(guī)格不相符。 |