ZHCSWN9D June 2003 – August 2024 CD4067B , CD4097B
PRODUCTION DATA
請參考 PDF 數(shù)據(jù)表獲取器件具體的封裝圖。
| THERMAL METRIC(1) | CD406x | CD406x | UNIT | |
|---|---|---|---|---|
| D (SOIC) | PW (TSSOP) | |||
| 14 PINS | 14 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 109.7 | 101.8 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 69.4 | 44.3 | °C/W |
| RθJB | Junction-to-board thermal resistance | 67.9 | 68.2 | °C/W |
| ΨJT | Junction-to-top characterization parameter | 25.8 | 3.2 | °C/W |
| ΨJB | Junction-to-board characterization parameter | 67.1 | 67.6 | °C/W |