ZHCSCE2I October 2013 – March 2022 BQ76920 , BQ76930 , BQ76940
PRODMIX
When switching between external and internal temperature monitoring, a 2-s latency may be incurred due to the natural scheduler update interval.
A die temperature block generates a voltage that is proportional to the die temperature, and provides a way of reducing component count if pack thermistors are not used or ensuring that the die power dissipation requirements are observed. The die is measured using the same on-board 14-bit ADC as the cell voltages.
To select internal die temperature measurement mode, set [TEMP_SEL] = 0.
For BQ76930 and BQ76940, multiple die temperature measurements are available. These are stored in TS2 and TS3.
To convert a DIETEMP reading into temperature, refer to the following equation box. If more accurate temperature readings are needed from DIETEMP, the DIETEMP at room temperature value should be stored during production calibration.
The following equation shows how to use the 14-bit ADC readings in TS1, TS2, and TS3 when [TEMPSEL] = 0 to determine the internal die temperature: