ZHCSJ56C February 2018 – September 2019 BQ25882
PRODUCTION DATA.
| THERMAL METRIC(1) | BQ25882 | UNIT | |
|---|---|---|---|
| YFF (DSBGA) | |||
| 25-BALL | |||
| RΘJA | Junction-to-ambient thermal resistance (EVM(2)) | 24 | °C/W |
| RΘJA | Junction-to-ambient thermal resistance (JEDEC (1)) | 64.4 | °C/W |
| RΘJC(top) | Junction-to-case (top) thermal resistance | 0.4 | °C/W |
| RΘJB | Junction-to-board thermal resistance | 14.8 | °C/W |
| ψJT | Junction-to-top characterization parameter | 0.2 | °C/W |
| ψJB | Junction-to-board characterization parameter | 14.9 | °C/W |
| RΘJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | °C/W |