ZHCSNY0B May 2020 – January 2023 BQ25798
PRODUCTION DATA
| THERMAL METRIC(1) | BQ25798 | UNIT | |
|---|---|---|---|
| RQM (QFN) | |||
| 29-PIN | |||
| RθJA | Junction-to-ambient thermal resistance | 44.2 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 20.9 | °C/W |
| RθJB | Junction-to-board thermal resistance | 9.7 | °C/W |
| ΨJT | Junction-to-top characterization parameter | 0.5 | °C/W |
| ΨJB | Junction-to-board characterization parameter | 9.7 | °C/W |