ZHCSPC2C September 2021 – January 2023 BQ25180
PRODUCTION DATA
| THERMAL METRIC | BQ25180 | UNIT | |
|---|---|---|---|
| YBG (DSBGA) | |||
| 8 PIN | |||
| RθJA | Junction-to-ambient thermal resistance (EVM(2)) | 65 | °C/W |
| RθJA | Junction-to-ambient thermal resistance (JEDEC(1)) | 107.1 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 0.9 | °C/W |
| RθJB | Junction-to-board thermal resistance | 30.3 | °C/W |
| ΨJT | Junction-to-top characterization parameter | 0.3 | °C/W |
| ΨJB | Junction-to-board characterization parameter | 30.3 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | °C/W |