ZHCSK30B August 2019 – April 2020 AMC1336
PRODUCTION DATA.
| THERMAL METRIC(1) | AMC1336 | UNIT | |
|---|---|---|---|
| DWV (SOIC) | |||
| 8 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 94 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 36 | °C/W |
| RθJB | Junction-to-board thermal resistance | 46.1 | °C/W |
| ψJT | Junction-to-top characterization parameter | 11.5 | °C/W |
| ψJB | Junction-to-board characterization parameter | 44.4 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | °C/W |