ZHCSF12G april 2016 – april 2023 AMC1301
PRODUCTION DATA
- 1
- 1 特性
- 2 應(yīng)用
- 3 說(shuō)明
- 4 Revision History
- Device Comparison Table
- 5 Pin Configuration and Functions
-
6 Specifications
- 6.1 Absolute Maximum Ratings
- 6.2 ESD Ratings
- 6.3 Recommended Operating Conditions
- 6.4 Thermal Information
- 6.5 Power Ratings
- 6.6 Insulation Specifications
- 6.7 Safety-Related Certifications
- 6.8 Safety Limiting Values
- 6.9 Electrical Characteristics
- 6.10 Switching Characteristics
- 6.11 Timing Diagram
- 6.12 Insulation Characteristics Curves
- 6.13 Typical Characteristics
- 7 Detailed Description
- 8 Application and Implementation
- 9 Device and Documentation Support
- 10Mechanical, Packaging, and Orderable Information
封裝選項(xiàng)
機(jī)械數(shù)據(jù) (封裝 | 引腳)
- DWV|8
散熱焊盤機(jī)械數(shù)據(jù) (封裝 | 引腳)
訂購(gòu)信息
7.3.2 Isolation Channel Signal Transmission
The AMC1301 uses an on-off keying (OOK) modulation scheme, as shown in Figure 7-1, to transmit the modulator output bitstream across the SiO2-based isolation barrier. The transmit driver (TX) shown in the Functional Block Diagram transmits an internally generated, high-frequency carrier across the isolation barrier to represent a digital one and does not send a signal to represent a digital zero. The nominal frequency of the carrier used inside the AMC1301 is 480 MHz.
The receiver (RX) on the other side of the isolation barrier recovers and demodulates the signal and provides the input to the fourth-order analog filter. The AMC1301 transmission channel is optimized to achieve the highest level of common-mode transient immunity (CMTI) and lowest level of radiated emissions caused by the high-frequency carrier and RX/TX buffer switching.
Figure 7-1 OOK-Based
Modulation Scheme