ZHCSF12G april 2016 – april 2023 AMC1301
PRODUCTION DATA
- 1
- 1 特性
- 2 應(yīng)用
- 3 說明
- 4 Revision History
- Device Comparison Table
- 5 Pin Configuration and Functions
-
6 Specifications
- 6.1 Absolute Maximum Ratings
- 6.2 ESD Ratings
- 6.3 Recommended Operating Conditions
- 6.4 Thermal Information
- 6.5 Power Ratings
- 6.6 Insulation Specifications
- 6.7 Safety-Related Certifications
- 6.8 Safety Limiting Values
- 6.9 Electrical Characteristics
- 6.10 Switching Characteristics
- 6.11 Timing Diagram
- 6.12 Insulation Characteristics Curves
- 6.13 Typical Characteristics
- 7 Detailed Description
- 8 Application and Implementation
- 9 Device and Documentation Support
- 10Mechanical, Packaging, and Orderable Information
封裝選項(xiàng)
機(jī)械數(shù)據(jù) (封裝 | 引腳)
- DWV|8
散熱焊盤機(jī)械數(shù)據(jù) (封裝 | 引腳)
訂購信息
8.4 Power Supply Recommendations
The AMC1301 does not require any specific power-up sequencing. The high-side power supply (AVDD) is decoupled with a low-ESR, 100-nF capacitor (C1) parallel to a low-ESR, 1-μF capacitor (C2). The low-side power supply (DVDD) is equally decoupled with a low-ESR, 100-nF capacitor (C3) parallel to a low-ESR, 1-μF capacitor (C4). Place all four capacitors (C1, C2, C3, and C4) as close to the device as possible.
The ground reference for the high-side (AGND) is derived from the end of the shunt resistor that is connected to the negative input (INN) of the device. For best DC accuracy, use a separate trace to make this connection instead of shorting AGND to INN directly at the device input. If a four-terminal shunt is used, the device inputs are connected to the inner leads and AGND is connected to the outer lead on the INN side of the shunt. Figure 8-5 shows a decoupling diagram of the AMC1301.
Figure 8-5 Decoupling of the AMC1301