SBASB17B October 2024 – October 2025 AMC0381D-Q1
PRODMIX
- 1
- 1 Features
- 2 Applications
- 3 Description
- 4 Device Comparison Table
- 5 Pin Configuration and Functions
-
6 Specifications
- 6.1 Absolute Maximum Ratings
- 6.2 ESD Ratings
- 6.3 Recommended Operating Conditions
- 6.4 Thermal Information
- 6.5 Power Ratings
- 6.6 Insulation Specifications
- 6.7 Safety-Related Certifications
- 6.8 Safety Limiting Values
- 6.9 Electrical Characteristics
- 6.10 Switching Characteristics
- 6.11 Timing Diagram
- 6.12 Insulation Characteristics Curves
- 6.13 Typical Characteristics
- 7 Detailed Description
- 8 Application and Implementation
- 9 Device and Documentation Support
- 10Revision History
- 11Mechanical, Packaging, and Orderable Information
封裝選項(xiàng)
機(jī)械數(shù)據(jù) (封裝 | 引腳)
- DFX|15
散熱焊盤機(jī)械數(shù)據(jù) (封裝 | 引腳)
訂購信息
5 Pin Configuration and Functions
Figure 5-1 DFX Package, 15-Pin SOIC (Top View)Table 5-1 Pin Functions
| PIN | TYPE | DESCRIPTION | |
|---|---|---|---|
| NO. | NAME | ||
| 1 | HVIN | Analog input | High-voltage input |
| 2 | SNSN | Analog input | Ground sense pin and inverting analog input to the amplifier. Connect to GND1. |
| 3, 7, 8, 12, 13, 15 | NC | N/A | No internal connection. The pin can be connected to any potential or left floating. |
| 4 | SNSP | Analog input | Sense voltage pin and noninverting analog input to the amplifier. Connect to an external filter capacitor or leave floating. |
| 5 | VDD1 | High-side power | Analog (high-side) power supply(1) |
| 6 | GND1 | High-side ground | High-side ground |
| 9 | GND2 | Low-side ground | Low-side ground |
| 10 | OUTN | Analog output | Inverting analog output |
| 11 | OUTP | Analog input | Noninverting analog output |
| 14 | VDD2 | Low-side power | Low-side power supply(1) |
(1) See the Power Supply Recommendations section for power-supply decoupling recommendations.