產品詳情

Bits (#) 4 Data rate (max) (Mbps) 120 Topology Open drain, Push-Pull Direction control (typ) Auto-direction Vin (min) (V) 1.1 Vin (max) (V) 3.6 Vout (min) (V) 0.74 Vout (max) (V) 3.6 Applications MMC, SD Card, SDIO Features Edge rate accelerator Technology family TXS Supply current (max) (mA) 0.036 Rating Catalog Operating temperature range (°C) -40 to 85
Bits (#) 4 Data rate (max) (Mbps) 120 Topology Open drain, Push-Pull Direction control (typ) Auto-direction Vin (min) (V) 1.1 Vin (max) (V) 3.6 Vout (min) (V) 0.74 Vout (max) (V) 3.6 Applications MMC, SD Card, SDIO Features Edge rate accelerator Technology family TXS Supply current (max) (mA) 0.036 Rating Catalog Operating temperature range (°C) -40 to 85
WQFN (RTW) 24 16 mm2 4 x 4
  • 6-to-12 Demultiplexer/Multiplexer Allows SDIO Port Expansion
  • Built-in Level Translator Eliminates Voltage Mismatch Between
    Baseband and SD Card or SDIO Peripheral
  • VCCA, VCCB0, and VCCB1 Each Operate Over Full 1.1-V to 3.6-V Range
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Performance A Port
    • 2000-V Human-Body Model (A114-B)
    • 100-V Machine Model (A115-A)
    • 1500-V Charged-Device Model (C101)
  • ±8-kV Contact Discharge IEC 61000-4-2 ESD Performance (B Port)

MicroStar Junior is a trademark of Texas Instruments.
  • 6-to-12 Demultiplexer/Multiplexer Allows SDIO Port Expansion
  • Built-in Level Translator Eliminates Voltage Mismatch Between
    Baseband and SD Card or SDIO Peripheral
  • VCCA, VCCB0, and VCCB1 Each Operate Over Full 1.1-V to 3.6-V Range
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Performance A Port
    • 2000-V Human-Body Model (A114-B)
    • 100-V Machine Model (A115-A)
    • 1500-V Charged-Device Model (C101)
  • ±8-kV Contact Discharge IEC 61000-4-2 ESD Performance (B Port)

MicroStar Junior is a trademark of Texas Instruments.

The TXS02612 is designed to interface the cell phone baseband with external SDIO peripherals. The device includes a 6-channel SPDT switch with voltage-level translation capability. This allows a single SDIO port to be interfaced with two SDIO peripherals. The TXS02612 has three separate supply rails that operate over the full range of 1.1 V to 3.6 V. This allows the baseband and SDIO peripherals to operate at different supply voltages if required.

The select (SEL) input is used to choose between the B0 port and B1 port. When SEL = Low, B0 port is selected; when SEL = High, B1 port is selected. SEL is referenced to VCCA. For the unselected B port, the clock output is held low, whereas the data and command I/Os are pulled high to their respective VCCB through a 70-k resistor (±30% tolerance).

The TXS02612 is designed to interface the cell phone baseband with external SDIO peripherals. The device includes a 6-channel SPDT switch with voltage-level translation capability. This allows a single SDIO port to be interfaced with two SDIO peripherals. The TXS02612 has three separate supply rails that operate over the full range of 1.1 V to 3.6 V. This allows the baseband and SDIO peripherals to operate at different supply voltages if required.

The select (SEL) input is used to choose between the B0 port and B1 port. When SEL = Low, B0 port is selected; when SEL = High, B1 port is selected. SEL is referenced to VCCA. For the unselected B port, the clock output is held low, whereas the data and command I/Os are pulled high to their respective VCCB through a 70-k resistor (±30% tolerance).
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類型 標題 下載最新的英語版本 日期
* 數據表 TXS02612 SDIO Port Expander With Voltage-Level Translation 數據表 (Rev. C) 2010年 2月 3日
應用手冊 原理圖檢查清單 - 使用自動雙向轉換器進行設計的指南 PDF | HTML 英語版 PDF | HTML 2024年 12月 3日
應用手冊 Understanding Transient Drive Strength vs. DC Drive Strength in Level-Shifters (Rev. A) PDF | HTML 2024年 7月 3日
應用手冊 了解 CMOS 輸出緩沖器中的瞬態驅動強度與直流驅動強度 PDF | HTML 最新英語版本 (Rev.A) PDF | HTML 2024年 5月 15日
應用手冊 SDIO 的電壓轉換 PDF | HTML 英語版 PDF | HTML 2022年 5月 19日
選擇指南 Voltage Translation Buying Guide (Rev. A) 2021年 4月 15日

設計和開發

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仿真模型

TXS02612 IBIS Model

SCEM555.ZIP (78 KB) - IBIS Model
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WQFN (RTW) 24 Ultra Librarian

訂購和質量

包含信息：
  • RoHS
  • REACH
  • 器件標識
  • 引腳鍍層/焊球材料
  • MSL 等級/回流焊峰值溫度
  • MTBF/時基故障估算
  • 材料成分
  • 鑒定摘要
  • 持續可靠性監測
包含信息：
  • 制造廠地點
  • 封裝廠地點

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