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TSU5511

已停產

具有阻抗檢測微型 USB 開關的 SP3T 開關

產品詳情

Type Passive mux Function USB 2.0 USB speed (Mbps) 480 Number of channels 2 Supply voltage (max) (V) 6.7 Supply voltage (min) (V) 2.8 Ron (typ) (mΩ) 4500 Input/output voltage (min) (V) -1.3 Input/output voltage (max) (V) 3.6 Configuration 3:1 Features Audio Switch (Negative Rail Capability), Charging Capability, Click-Pop Reduction, I2C interface, Impedance Detection, UART, USB 2.0 Rating Catalog Operating temperature range (°C) -40 to 85 Supply current (max) (μA) 70 ESD HBM (typ) (kV) 2 Bandwidth (MHz) 830
Type Passive mux Function USB 2.0 USB speed (Mbps) 480 Number of channels 2 Supply voltage (max) (V) 6.7 Supply voltage (min) (V) 2.8 Ron (typ) (mΩ) 4500 Input/output voltage (min) (V) -1.3 Input/output voltage (max) (V) 3.6 Configuration 3:1 Features Audio Switch (Negative Rail Capability), Charging Capability, Click-Pop Reduction, I2C interface, Impedance Detection, UART, USB 2.0 Rating Catalog Operating temperature range (°C) -40 to 85 Supply current (max) (μA) 70 ESD HBM (typ) (kV) 2 Bandwidth (MHz) 830
DSBGA (YZP) 20 6.1875 mm2 2.25 x 2.75
  • Compatible Accessories
    • USB Data Cable
    • UART Cable
    • Charger (Dedicated Charger or Host/Hub Charger)
    • Stereo Headset With Mic
  • Integrated LDOs for VREF and Mic Bias
  • USB Path Supports USB 2.0 High Speed
  • Audio Path Provides Negative Rail Support and Click/Pop Reduction
  • Supports Factory Test Mode
  • 1.8-V Compatible I2C Interface
  • ESD Performance Tested Per JESD 22
    • 2000-V Human-Body Model
      (A114-B, Class II)
    • 1000-V Charged-Device Model (C101)
  • ESD Performance DP/DM/ID/VBUS to GND
    • ±8-kV Contact Discharge (IEC 61000-4-2)
    • ±15-kV Air Gap Discharge (IEC 61000-4-2)
  • APPLICATIONS
    • Cellular Telephones
  • Compatible Accessories
    • USB Data Cable
    • UART Cable
    • Charger (Dedicated Charger or Host/Hub Charger)
    • Stereo Headset With Mic
  • Integrated LDOs for VREF and Mic Bias
  • USB Path Supports USB 2.0 High Speed
  • Audio Path Provides Negative Rail Support and Click/Pop Reduction
  • Supports Factory Test Mode
  • 1.8-V Compatible I2C Interface
  • ESD Performance Tested Per JESD 22
    • 2000-V Human-Body Model
      (A114-B, Class II)
    • 1000-V Charged-Device Model (C101)
  • ESD Performance DP/DM/ID/VBUS to GND
    • ±8-kV Contact Discharge (IEC 61000-4-2)
    • ±15-kV Air Gap Discharge (IEC 61000-4-2)
  • APPLICATIONS
    • Cellular Telephones

The TSU5511 is designed to interface the cell phone UART, USB, and audio chips with external peripherals via a micro-USB connector. The switch features impedance detection for identification of various accessories that are attached through DP and DM of the micro-USB port. When an accessory is plugged into the micro-USB port, the switch uses a detection mechanism to identify the accessory (see State Machine for details). It will then switch to the appropriate channel—data, audio, or UART.

The TSU5511 has an I2C interface for communication with the cellphone baseband or applications processor. An interrupt is generated when anything plugged into the micro-USB is detected. Another interrupt is generated when the device is unplugged.

The TSU5511 is designed to interface the cell phone UART, USB, and audio chips with external peripherals via a micro-USB connector. The switch features impedance detection for identification of various accessories that are attached through DP and DM of the micro-USB port. When an accessory is plugged into the micro-USB port, the switch uses a detection mechanism to identify the accessory (see State Machine for details). It will then switch to the appropriate channel—data, audio, or UART.

The TSU5511 has an I2C interface for communication with the cellphone baseband or applications processor. An interrupt is generated when anything plugged into the micro-USB is detected. Another interrupt is generated when the device is unplugged.
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類型 標題 下載最新的英語版本 日期
* 數據表 SP3T SWITCH WITH IMPEDANCE DETECTION 數據表 2010年 9月 2日

訂購和質量

包含信息：
  • RoHS
  • REACH
  • 器件標識
  • 引腳鍍層/焊球材料
  • MSL 等級/回流焊峰值溫度
  • MTBF/時基故障估算
  • 材料成分
  • 鑒定摘要
  • 持續可靠性監測
包含信息：
  • 制造廠地點
  • 封裝廠地點