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TS3USB31E

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具有單使能端的高速 USB 2.0 (480Mbps) 1 端口開關

產品詳情

Type Passive mux Function USB 2.0 USB speed (Mbps) 480 Number of channels 2 Supply voltage (max) (V) 4.3 Supply voltage (min) (V) 2.25 Ron (typ) (mΩ) 6500 Input/output voltage (min) (V) 0 Input/output voltage (max) (V) 4.3 Configuration 1:1 SPST Features Logic Controlled (Output Enabled), USB 2.0 Rating Catalog Operating temperature range (°C) -40 to 85 Supply current (max) (μA) 1 ESD HBM (typ) (kV) 8 Bandwidth (MHz) 1100
Type Passive mux Function USB 2.0 USB speed (Mbps) 480 Number of channels 2 Supply voltage (max) (V) 4.3 Supply voltage (min) (V) 2.25 Ron (typ) (mΩ) 6500 Input/output voltage (min) (V) 0 Input/output voltage (max) (V) 4.3 Configuration 1:1 SPST Features Logic Controlled (Output Enabled), USB 2.0 Rating Catalog Operating temperature range (°C) -40 to 85 Supply current (max) (μA) 1 ESD HBM (typ) (kV) 8 Bandwidth (MHz) 1100
UQFN (RSE) 8 2.25 mm2 1.5 x 1.5
  • VCC Operation 2.25 V to 4.3 V
  • 1.8-V Compatible Control-Pin Inputs
  • IOFF Supports Partial Power-Down Mode Operation
  • ron = 10 Ω Maximum
  • Δron <0.35 Ω Typical
  • Cio(ON) = 6 pF Typical
  • Low Power Consumption (1 μA Maximum)
  • ESD Performance Tested Per JESD 22
    • 8000-V Human-Body Model
      (A114-B, Class II)
    • 1000-V Charged-Device Model (C101)
    • 250-V Machine Model (A115-A)
  • ESD Performance COM Port to GND
    • 15000-V Human-Body Model
      (A114-B, Class II)
  • Wide –3-dB Bandwidth = 1100 MHz Typical
  • Packaged in 8-Pin TQFN (1.5 mm × 1.5 mm)
  • APPLICATIONS
    • Routes Signals for USB 1.0, 1.1, and 2.0

All other trademarks are the property of their respective owners

  • VCC Operation 2.25 V to 4.3 V
  • 1.8-V Compatible Control-Pin Inputs
  • IOFF Supports Partial Power-Down Mode Operation
  • ron = 10 Ω Maximum
  • Δron <0.35 Ω Typical
  • Cio(ON) = 6 pF Typical
  • Low Power Consumption (1 μA Maximum)
  • ESD Performance Tested Per JESD 22
    • 8000-V Human-Body Model
      (A114-B, Class II)
    • 1000-V Charged-Device Model (C101)
    • 250-V Machine Model (A115-A)
  • ESD Performance COM Port to GND
    • 15000-V Human-Body Model
      (A114-B, Class II)
  • Wide –3-dB Bandwidth = 1100 MHz Typical
  • Packaged in 8-Pin TQFN (1.5 mm × 1.5 mm)
  • APPLICATIONS
    • Routes Signals for USB 1.0, 1.1, and 2.0

All other trademarks are the property of their respective owners

The TS3USB31E is a high-bandwidth switch specially designed for the switching of high-speed USB 2.0 signals in handset and consumer applications, such as cell phones, digital cameras, and notebooks with hubs or controllers with limited USB I/Os. The wide bandwidth (1100 MHz) of this switch allows signals to pass with minimum edge and phase distortion. The switch is bidirectional and offers little or no attenuation of the high-speed signals at the outputs. It is designed for low bit-to-bit skew and high channel-to-channel noise isolation, and is compatible with various standards, such as high-speed USB 2.0 (480 Mbps).

The TS3USB31E is a high-bandwidth switch specially designed for the switching of high-speed USB 2.0 signals in handset and consumer applications, such as cell phones, digital cameras, and notebooks with hubs or controllers with limited USB I/Os. The wide bandwidth (1100 MHz) of this switch allows signals to pass with minimum edge and phase distortion. The switch is bidirectional and offers little or no attenuation of the high-speed signals at the outputs. It is designed for low bit-to-bit skew and high channel-to-channel noise isolation, and is compatible with various standards, such as high-speed USB 2.0 (480 Mbps).

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類型 標題 下載最新的英語版本 日期
* 數據表 TS3USB31E High-Speed USB 2.0 (480-Mbps) 1-Port Switch with Single Enable and ESD Protection 數據表 (Rev. A) PDF | HTML 2016年 8月 29日
應用手冊 根據帶寬選擇無源多路復用器 (Rev. A) PDF | HTML 英語版 (Rev.A) PDF | HTML 2024年 8月 30日
應用手冊 High-Speed Layout Guidelines for Signal Conditioners and USB Hubs 2018年 6月 14日

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用戶指南: PDF
英語版 (Rev.A): PDF
封裝 引腳 CAD 符號、封裝和 3D 模型
UQFN (RSE) 8 Ultra Librarian

訂購和質量

包含信息:
  • RoHS
  • REACH
  • 器件標識
  • 引腳鍍層/焊球材料
  • MSL 等級/回流焊峰值溫度
  • MTBF/時基故障估算
  • 材料成分
  • 鑒定摘要
  • 持續可靠性監測
包含信息:
  • 制造廠地點
  • 封裝廠地點

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