TS3L100
- Wide Bandwidth (BW = 350 MHz Min)
- Low Differential Crosstalk (XTALK = –68 dB Typ)
- Low Power Consumption (ICC = 10 μA Max)
- Bidirectional Data Flow, With Near-Zero Propagation Delay
- Low ON-State Resistance (ron = 5
Typ) - Rail-to-Rail Switching on Data I/O Ports (0 to VCC)
- VCC Operating Range From 3 V to 3.6 V
- Ioff Supports Partial-Power-Down Mode Operation
- Data and Control Inputs Have Undershoot Clamp Diodes
- Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
- ESD Performance Tested Per JESD 22
- 2000-V Human-Body Model (A114-B, Class II)
- 1000-V Charged-Device Model (C101)
- Suitable for Both 10 Base-T/100 Base-T Signaling
The TI TS3L100 LAN switch is a 4-bit 1-of-2 multiplexer/demultiplexer with a single switch-enable (E)\ input. When E\ is low, the switch is enabled and the I port is connected to the Y port. When E\ is high, the switch is disabled and the high-impedance state exists between the I and Y ports. The select (S) input controls the data path of the multiplexer/demultiplexer.
This device can be used to replace mechanical relays in LAN applications. This device has low ron, wide bandwidth, and low differential crosstalk, making it suitable for 10 Base-T, 100 Base-T, and various other LAN applications.
This device is fully specified for partial-power-down applications using Ioff. The Ioff feature ensures that damaging current will not backflow through the device when it is powered down. The device has isolation during power off.
To ensure the high-impedance state during power up or power down, E\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
技術(shù)文檔
| 類型 | 標(biāo)題 | 下載最新的英語版本 | 日期 | |||
|---|---|---|---|---|---|---|
| * | 數(shù)據(jù)表 | TS3L100 數(shù)據(jù)表 (Rev. A) | 2004年 10月 12日 | |||
| 更多文獻(xiàn)資料 | TS5L100 and TS3L100 Application Clip | 2004年 5月 25日 |
設(shè)計(jì)和開發(fā)
如需其他信息或資源,請點(diǎn)擊以下任一標(biāo)題進(jìn)入詳情頁面查看(如有)。
LEADED-ADAPTER1 — 表面貼裝轉(zhuǎn) DIP 接頭適配器,用于快速測試 TI 的 5、8、10、16 和 24 引腳引線式封裝。
EVM-LEADED1 電路板可用于對 TI 的常見引線式封裝進(jìn)行快速測試和電路板試驗(yàn)。? 該電路板具有足夠的空間,可將 TI 的 D、DBQ、DCT、DCU、DDF、DGS、DGV 和 PW 表面貼裝封裝轉(zhuǎn)換為 100mil DIP 接頭。?????
LEADLESS-ADAPTER1 — 表面貼裝轉(zhuǎn) DIP 接頭適配器,用于測試 TI 的 6、8、10、12、14、16 和 20 引腳無引線封裝
| 封裝 | 引腳 | CAD 符號、封裝和 3D 模型 |
|---|---|---|
| SOIC (D) | 16 | Ultra Librarian |
| SSOP (DBQ) | 16 | Ultra Librarian |
| TSSOP (PW) | 16 | Ultra Librarian |
| TVSOP (DGV) | 16 | Ultra Librarian |
| VQFN (RGY) | 16 | Ultra Librarian |
訂購和質(zhì)量
- RoHS
- REACH
- 器件標(biāo)識
- 引腳鍍層/焊球材料
- MSL 等級/回流焊峰值溫度
- MTBF/時(shí)基故障估算
- 材料成分
- 鑒定摘要
- 持續(xù)可靠性監(jiān)測
- 制造廠地點(diǎn)
- 封裝廠地點(diǎn)
推薦產(chǎn)品可能包含與 TI 此產(chǎn)品相關(guān)的參數(shù)、評估模塊或參考設(shè)計(jì)。