TPS65708
- Two 400-mA Step-Down Converters
- Up to 95% Efficiency
- VIN Range for DC-DC Converters From
3.6 V to 6 V - 2.25-MHz Fixed-Frequency Operation
- Power Save Mode at Light Load Current
- Output Voltage Accuracy in PWM mode ±1.5%
- 100% Duty Cycle for Lowest Dropout
- 180° Out-of-Phase Operation
- 2 General Purpose 200-mA LDOs
- LDOs Optionally Powered From Step-Down
Converters - 7.5-mA PWM Dimmable Current Sink
- Available in a 16-Ball DSBGA (WCSP) With
0.5-mm Pitch - Device Options:
- VDCDC1 = 3.3 V
- VDCDC2 = 1.8 V
- VLDO1 = 2.8 V
- VLDO2 = 1.2 V
- ISINK(PWM=1) = 7.5 mA
- SEQUENCING : DCDC1, LDO1, DCDC2,
LDO2
- APPLICATIONS
- Monitors
- Laptops
- Handheld Equipment
All other trademarks are the property of their respective owners
The TPS65708 device is a power management unit targeted for embedded camera modules or other portable low-power consumer end equipment. The device contains two high-efficiency step-down converters, two low-dropout linear regulators, and a 7.5-mA current sink for driving a LED. The 2.25-MHz step-down converter enters a low-power mode at light load for maximum efficiency across the widest possible range of load currents. For low-noise applications, the devices can be forced into fixed-frequency PWM mode using the MODE pin. The device allows the use of small inductors and capacitors to achieve a small solution size. The TPS65708 device provides an output current of up to 400 mA on both DC-DC converters and up to 200 mA on each of the LDOs. The enable signal to the DC-DC converters and LDOs is generated internally by the undervoltage lockout circuit.
The TPS65708 comes in a small 16-pin wafer chip-scale package (WCSP) with 0.5-mm ball pitch.
技術(shù)文檔
| 頂層文檔 | 類型 | 標(biāo)題 | 格式選項(xiàng) | 下載最新的英語(yǔ)版本 | 日期 | |
|---|---|---|---|---|---|---|
| * | 數(shù)據(jù)表 | TPS65708 PMU for Embedded Camera Module 數(shù)據(jù)表 (Rev. B) | PDF | HTML | 2015年 9月 23日 | ||
| 應(yīng)用手冊(cè) | LDO 噪聲揭秘 (Rev. B) | PDF | HTML | 英語(yǔ)版 (Rev.B) | PDF | HTML | 2020年 9月 16日 | |
| 應(yīng)用手冊(cè) | LDO PSRR Measurement Simplified (Rev. A) | PDF | HTML | 2017年 8月 9日 |
設(shè)計(jì)與開(kāi)發(fā)
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| 封裝 | 引腳 | CAD 符號(hào)、封裝和 3D 模型 |
|---|---|---|
| DSBGA (YZH) | 16 | Ultra Librarian |
訂購(gòu)和質(zhì)量
- RoHS
- REACH
- 器件標(biāo)識(shí)
- 引腳鍍層/焊球材料
- MSL 等級(jí)/回流焊峰值溫度
- MTBF/時(shí)基故障估算
- 材料成分
- 鑒定摘要
- 持續(xù)可靠性監(jiān)測(cè)
- 制造廠地點(diǎn)
- 封裝廠地點(diǎn)