TPS657052
- Two 400-mA Step-Down Converters
- Up to 92% Efficiency
- VIN Range for DC-DC Converter
From 3.3 V to 6 V - 2.25-MHz Fixed-Frequency Operation
- Power Save Mode at Light Load Current
- Output Voltage Accuracy in PWM Mode ±1.5%
- 100% Duty Cycle for Lowest Dropout
- 180° Out-of-Phase Operation
- 1 General Purpose 200-mA LDO
- VIN Range for LDO From 1.7 V to 6.0 V
- Available in a 16-Ball DSBGA (WCSP) With 0.5-
mm Pitch
The TPS65705x devices are small power management units targeted for embedded camera module or other portable low-power consumer-end equipments. The device contains two highly efficient step-down converters, a low dropout linear regulator, and additional supporting functions. The 2.25-MHz step-down converter enters a low-power mode at light load for maximum efficiency across the widest possible range of load currents. For low-noise applications, the device can be forced into fixed-frequency PWM mode using the MODE pin. The device allows the use of small inductors and capacitors to achieve a small sized solution. The TPS65705x provides an output current of up to 400 mA on both DC-DC converters and integrates one 200-mA LDO with different output settings. The LDO operates with an input voltage range from 1.7 V to 6 V, thus allowing it to be supplied from the output of the step-down converter or directly from the system voltage.
The TPS65705x comes in a small 16-pin wafer chip scale package (WCSP) with 0.5-mm ball pitch.
技術(shù)文檔
| 頂層文檔 | 類(lèi)型 | 標(biāo)題 | 格式選項(xiàng) | 下載最新的英語(yǔ)版本 | 日期 | |
|---|---|---|---|---|---|---|
| * | 數(shù)據(jù)表 | TPS65705x PMU for Embedded Camera Module 數(shù)據(jù)表 (Rev. A) | PDF | HTML | 2015年 9月 30日 | ||
| 應(yīng)用手冊(cè) | LDO 噪聲揭秘 (Rev. B) | PDF | HTML | 英語(yǔ)版 (Rev.B) | PDF | HTML | 2020年 9月 16日 | |
| 應(yīng)用手冊(cè) | LDO PSRR Measurement Simplified (Rev. A) | PDF | HTML | 2017年 8月 9日 |
設(shè)計(jì)與開(kāi)發(fā)
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| 封裝 | 引腳 | CAD 符號(hào)、封裝和 3D 模型 |
|---|---|---|
| DSBGA (YZH) | 16 | Ultra Librarian |
訂購(gòu)和質(zhì)量
- RoHS
- REACH
- 器件標(biāo)識(shí)
- 引腳鍍層/焊球材料
- MSL 等級(jí)/回流焊峰值溫度
- MTBF/時(shí)基故障估算
- 材料成分
- 鑒定摘要
- 持續(xù)可靠性監(jiān)測(cè)
- 制造廠地點(diǎn)
- 封裝廠地點(diǎn)