TPS657052

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3 通道電源管理 IC (PMIC)

產品詳情

Product type Processor and FPGA Regulated outputs (#) 3 Step-down DC/DC converter 2 Step-up DC/DC converter 0 LDO 1 Vin (min) (V) 1.7 Vin (max) (V) 6 Vout (min) (V) 1.8 Vout (max) (V) 3.3 Iout (max) (A) 0.4 Configurability Factory programmable Features Enable pin Rating Catalog Operating temperature range (°C) -40 to 85 Step-down DC/DC controller 0 Step-up DC/DC controller 0 Iq (typ) (mA) 0.005 Switching frequency (max) (kHz) 2250 Shutdown current (ISD) (typ) (μA) 5 Switching frequency (typ) (kHz) 2250
Product type Processor and FPGA Regulated outputs (#) 3 Step-down DC/DC converter 2 Step-up DC/DC converter 0 LDO 1 Vin (min) (V) 1.7 Vin (max) (V) 6 Vout (min) (V) 1.8 Vout (max) (V) 3.3 Iout (max) (A) 0.4 Configurability Factory programmable Features Enable pin Rating Catalog Operating temperature range (°C) -40 to 85 Step-down DC/DC controller 0 Step-up DC/DC controller 0 Iq (typ) (mA) 0.005 Switching frequency (max) (kHz) 2250 Shutdown current (ISD) (typ) (μA) 5 Switching frequency (typ) (kHz) 2250
DSBGA (YZH) 16 5.0625 mm2 2.25 x 2.25
  • Two 400-mA Step-Down Converters
  • Up to 92% Efficiency
  • VIN Range for DC-DC Converter
    From 3.3 V to 6 V
  • 2.25-MHz Fixed-Frequency Operation
  • Power Save Mode at Light Load Current
  • Output Voltage Accuracy in PWM Mode ±1.5%
  • 100% Duty Cycle for Lowest Dropout
  • 180° Out-of-Phase Operation
  • 1 General Purpose 200-mA LDO
  • VIN Range for LDO From 1.7 V to 6.0 V
  • Available in a 16-Ball DSBGA (WCSP) With 0.5-
    mm Pitch
  • Two 400-mA Step-Down Converters
  • Up to 92% Efficiency
  • VIN Range for DC-DC Converter
    From 3.3 V to 6 V
  • 2.25-MHz Fixed-Frequency Operation
  • Power Save Mode at Light Load Current
  • Output Voltage Accuracy in PWM Mode ±1.5%
  • 100% Duty Cycle for Lowest Dropout
  • 180° Out-of-Phase Operation
  • 1 General Purpose 200-mA LDO
  • VIN Range for LDO From 1.7 V to 6.0 V
  • Available in a 16-Ball DSBGA (WCSP) With 0.5-
    mm Pitch

The TPS65705x devices are small power management units targeted for embedded camera module or other portable low-power consumer-end equipments. The device contains two highly efficient step-down converters, a low dropout linear regulator, and additional supporting functions. The 2.25-MHz step-down converter enters a low-power mode at light load for maximum efficiency across the widest possible range of load currents. For low-noise applications, the device can be forced into fixed-frequency PWM mode using the MODE pin. The device allows the use of small inductors and capacitors to achieve a small sized solution. The TPS65705x provides an output current of up to 400 mA on both DC-DC converters and integrates one 200-mA LDO with different output settings. The LDO operates with an input voltage range from 1.7 V to 6 V, thus allowing it to be supplied from the output of the step-down converter or directly from the system voltage.

The TPS65705x comes in a small 16-pin wafer chip scale package (WCSP) with 0.5-mm ball pitch.

The TPS65705x devices are small power management units targeted for embedded camera module or other portable low-power consumer-end equipments. The device contains two highly efficient step-down converters, a low dropout linear regulator, and additional supporting functions. The 2.25-MHz step-down converter enters a low-power mode at light load for maximum efficiency across the widest possible range of load currents. For low-noise applications, the device can be forced into fixed-frequency PWM mode using the MODE pin. The device allows the use of small inductors and capacitors to achieve a small sized solution. The TPS65705x provides an output current of up to 400 mA on both DC-DC converters and integrates one 200-mA LDO with different output settings. The LDO operates with an input voltage range from 1.7 V to 6 V, thus allowing it to be supplied from the output of the step-down converter or directly from the system voltage.

The TPS65705x comes in a small 16-pin wafer chip scale package (WCSP) with 0.5-mm ball pitch.

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類型 標題 下載最新的英語版本 日期
* 數據表 TPS65705x PMU for Embedded Camera Module 數據表 (Rev. A) PDF | HTML 2015年 9月 30日
應用手冊 LDO 噪聲揭秘 (Rev. B) PDF | HTML 英語版 (Rev.B) PDF | HTML 2020年 9月 16日
應用手冊 LDO PSRR Measurement Simplified (Rev. A) PDF | HTML 2017年 8月 9日

設計和開發

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封裝 引腳 CAD 符號、封裝和 3D 模型
DSBGA (YZH) 16 Ultra Librarian

訂購和質量

包含信息:
  • RoHS
  • REACH
  • 器件標識
  • 引腳鍍層/焊球材料
  • MSL 等級/回流焊峰值溫度
  • MTBF/時基故障估算
  • 材料成分
  • 鑒定摘要
  • 持續可靠性監測
包含信息:
  • 制造廠地點
  • 封裝廠地點

支持和培訓

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