產品詳情

Audio input type Analog Input Architecture Class-AB Speaker channels (max) Mono Control interface Hardware Output power (W) 0.35 Power stage supply (max) (V) 5.5 Power stage supply (min) (V) 2.5 THD + N at 1 kHz (%) 1 Load (min) (Ω) 8 Analog supply voltage (min) (V) 2.5 Analog supply voltage (max) (V) 5.5 Rating Catalog Operating temperature range (°C) -40 to 85
Audio input type Analog Input Architecture Class-AB Speaker channels (max) Mono Control interface Hardware Output power (W) 0.35 Power stage supply (max) (V) 5.5 Power stage supply (min) (V) 2.5 THD + N at 1 kHz (%) 1 Load (min) (Ω) 8 Analog supply voltage (min) (V) 2.5 Analog supply voltage (max) (V) 5.5 Rating Catalog Operating temperature range (°C) -40 to 85
HVSSOP (DGN) 8 14.7 mm2 3 x 4.9 SOIC (D) 8 29.4 mm2 4.9 x 6
  • Fully Specified for 3.3-V and 5-V Operation
  • Wide Power Supply Compatibility 2.5 V - 5.5 V
  • Output Power for RL = 8
    • 350 mW at VDD = 5 V, BTL
    • 250 mW at VDD = 3.3 V, BTL
  • Ultra-Low Quiescent Current in Shutdown Mode...0.15 μA
  • Thermal and Short-Circuit Protection
  • Surface-Mount Packaging
    • SOIC
    • PowerPAD? MSOP

PowerPAD is a trademark of Texas Instruments Incorporated.
  • Fully Specified for 3.3-V and 5-V Operation
  • Wide Power Supply Compatibility 2.5 V - 5.5 V
  • Output Power for RL = 8
    • 350 mW at VDD = 5 V, BTL
    • 250 mW at VDD = 3.3 V, BTL
  • Ultra-Low Quiescent Current in Shutdown Mode...0.15 μA
  • Thermal and Short-Circuit Protection
  • Surface-Mount Packaging
    • SOIC
    • PowerPAD? MSOP

PowerPAD is a trademark of Texas Instruments Incorporated.

The TPA301 is a bridge-tied load (BTL) audio power amplifier developed especially for low-voltage applications where internal speakers are required. Operating with a 3.3-V supply, the TPA301 can deliver 250-mW of continuous power into a BTL 8- load at less than 1% THD+N throughout voice band frequencies. Although this device is characterized out to 20 kHz, its operation was optimized for narrower band applications such as cellular communications. The BTL configuration eliminates the need for external coupling capacitors on the output in most applications, which is particularly important for small battery-powered equipment. This device features a shutdown mode for power-sensitive applications with a quiescent current of 0.15 µA during shutdown. The TPA301 is available in an 8-pin SOIC surface-mount package and the surface-mount PowerPAD MSOP, which reduces board space by 50% and height by 40%.

The TPA301 is a bridge-tied load (BTL) audio power amplifier developed especially for low-voltage applications where internal speakers are required. Operating with a 3.3-V supply, the TPA301 can deliver 250-mW of continuous power into a BTL 8- load at less than 1% THD+N throughout voice band frequencies. Although this device is characterized out to 20 kHz, its operation was optimized for narrower band applications such as cellular communications. The BTL configuration eliminates the need for external coupling capacitors on the output in most applications, which is particularly important for small battery-powered equipment. This device features a shutdown mode for power-sensitive applications with a quiescent current of 0.15 µA during shutdown. The TPA301 is available in an 8-pin SOIC surface-mount package and the surface-mount PowerPAD MSOP, which reduces board space by 50% and height by 40%.
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類型 標題 下載最新的英語版本 日期
* 數據表 TPA301: 350-mW Mono Audio Power Amplifier 數據表 (Rev. E) 2004年 6月 24日
應用手冊 PowerPAD? Thermally Enhanced Package (Rev. H) 2018年 7月 6日
用戶指南 TPA301EVM - User Guide (Rev. A) 2001年 4月 17日

設計和開發

如需其他信息或資源，請點擊以下任一標題進入詳情頁面查看（如有）。

評估板

TPA301EVM — TPA301 評估模塊 (EVM)

A low-voltage bridge-tied load (BTL) audio power amplifier capable of delivering 350-mW to the load. It is characterized at 3.3-V and 5-V, but will operate from 2-V to 5.5-V. To minimize power consumption, this device features a shutdown mode, holding IDD <0.15 µA. Package: 8-pin SOIC.

用戶指南: PDF
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子卡

BOOSTXL-AUDIO — 音頻信號處理 BoosterPack 插件模塊

插入 LaunchPad? 開發套件時，BOOSTXL-AUDIO Audio BoosterPack? 插件模塊可從麥克風采集音頻輸入并通過板載揚聲器輸出音頻。也支持耳機輸入和輸出。這種音頻輸入/輸出流讓開發人員能夠對隨附 LaunchPad 開發套件上微控制器 (MCU) 的數字信號處理 (DSP) 和濾波功能進行實驗。

可通過多種方案（可通過 BoosterPack 上的跳線進行選擇）將揚聲器連接到 LaunchPad 的 MCU：(1) 通過 SPI 將音頻數據輸出到音頻 BoosterPack 上提供的 SPI DAC；(2) 直接連接到 LaunchPad MCU 上的 (...)

用戶指南: PDF
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仿真模型

TPA301 PSpice Model

SLOM361.ZIP (21 KB) - PSpice Model
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模擬工具

PSPICE-FOR-TI — PSpice? for TI 設計和仿真工具

PSpice? for TI 可提供幫助評估模擬電路功能的設計和仿真環境。此功能齊全的設計和仿真套件使用 Cadence? 的模擬分析引擎。PSpice for TI 可免費使用，包括業內超大的模型庫之一，涵蓋我們的模擬和電源產品系列以及精選的模擬行為模型。

借助?PSpice for TI 的設計和仿真環境及其內置的模型庫，您可對復雜的混合信號設計進行仿真。創建完整的終端設備設計和原型解決方案，然后再進行布局和制造，可縮短產品上市時間并降低開發成本。?

在?PSpice for TI 設計和仿真工具中，您可以搜索 TI (...)
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參考設計

TIDM-VOICEBANDAUDIO — 采用 PWM DAC 的語音頻帶音頻回放

此設計為低成本音頻輸出，基于生成 PWM 的計時器以及帶放大器級的外部低通濾波器，適用于耳機或揚聲器。音頻數據存儲在板載 SPI 閃存中。此設計提供含 Launchpad 直通代碼的 PC GUI，用于向 SPI 閃存中加載音頻數據。
設計指南: PDF
原理圖: PDF
封裝 引腳 CAD 符號、封裝和 3D 模型
HVSSOP (DGN) 8 Ultra Librarian
SOIC (D) 8 Ultra Librarian

訂購和質量

包含信息：
  • RoHS
  • REACH
  • 器件標識
  • 引腳鍍層/焊球材料
  • MSL 等級/回流焊峰值溫度
  • MTBF/時基故障估算
  • 材料成分
  • 鑒定摘要
  • 持續可靠性監測
包含信息：
  • 制造廠地點
  • 封裝廠地點

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