產品詳情

Audio input type Analog Input Architecture Class-D Speaker channels (max) Stereo Control interface GPIO Output power (W) 2.1 Power stage supply (max) (V) 5.5 Power stage supply (min) (V) 2.5 THD + N at 1 kHz (%) 0.14 Load (min) (Ω) 4 Analog supply voltage (min) (V) 2.5 Analog supply voltage (max) (V) 5.5 Rating Catalog Operating temperature range (°C) -40 to 85
Audio input type Analog Input Architecture Class-D Speaker channels (max) Stereo Control interface GPIO Output power (W) 2.1 Power stage supply (max) (V) 5.5 Power stage supply (min) (V) 2.5 THD + N at 1 kHz (%) 0.14 Load (min) (Ω) 4 Analog supply voltage (min) (V) 2.5 Analog supply voltage (max) (V) 5.5 Rating Catalog Operating temperature range (°C) -40 to 85
DSBGA (YZH) 16 5.0625 mm2 2.25 x 2.25 WQFN (RTJ) 20 16 mm2 4 x 4
  • Output Power By Package:
    • WQFN:
      • 2.1 W/Ch Into 4 Ω at 5 V
      • 1.4 W/Ch Into 8 Ω at 5 V
      • 720 mW/Ch Into 8 Ω at 3.6 V
    • DSBGA:
      • 1.2 W/Ch Into 4 Ω at 5 V
        (Thermally Limited)
      • 1.3 W/Ch Into 8 Ω at 5 V
      • 720 mW/Ch Into 8 Ω at 3.6 V
  • Only Two External Components Required
  • Power Supply Range: 2.5 V to 5.5 V
  • Independent Shutdown Control for Each Channel
  • Selectable Gain of 6, 12, 18, and 24 dB
  • Internal Pulldown Resistor on Shutdown Pins
  • High PSRR: 77 dB at 217 Hz
  • Fast Start-Up Time (3.5 ms)
  • Low Supply Current
  • Low Shutdown Current
  • Short-Circuit and Thermal Protection
  • Space-Saving Packages
    • 2.01-mm × 2.01-mm NanoFree? DSBGA (YZH)
    • 4-mm × 4-mm Thin WQFN (RTJ) With PowerPAD?
  • Output Power By Package:
    • WQFN:
      • 2.1 W/Ch Into 4 Ω at 5 V
      • 1.4 W/Ch Into 8 Ω at 5 V
      • 720 mW/Ch Into 8 Ω at 3.6 V
    • DSBGA:
      • 1.2 W/Ch Into 4 Ω at 5 V
        (Thermally Limited)
      • 1.3 W/Ch Into 8 Ω at 5 V
      • 720 mW/Ch Into 8 Ω at 3.6 V
  • Only Two External Components Required
  • Power Supply Range: 2.5 V to 5.5 V
  • Independent Shutdown Control for Each Channel
  • Selectable Gain of 6, 12, 18, and 24 dB
  • Internal Pulldown Resistor on Shutdown Pins
  • High PSRR: 77 dB at 217 Hz
  • Fast Start-Up Time (3.5 ms)
  • Low Supply Current
  • Low Shutdown Current
  • Short-Circuit and Thermal Protection
  • Space-Saving Packages
    • 2.01-mm × 2.01-mm NanoFree? DSBGA (YZH)
    • 4-mm × 4-mm Thin WQFN (RTJ) With PowerPAD?

The TPA2012D2 is a stereo, filter-free, Class-D audio amplifier (Class-D amp) available in a DSBGA or WQFN package. The TPA2012D2 only requires two external components for operation.

The TPA2012D2 features independent shutdown controls for each channel. The gain can be selected to 6, 12, 18, or 24 dB using the G0 and G1 gain select pins. High PSRR and differential architecture provide increased immunity to noise and RF rectification. In addition to these features, a fast start-up time and small package size make the TPA2012D2 class-D amp an ideal choice for both cellular handsets and PDAs.

The TPA2012D2 is capable of driving 1.4 W/Ch at
5 V or 720 mW/Ch at 3.6 V into 8 Ω. The TPA2012D2 is also capable of driving 4 Ω. The TPA2012D2 is thermally limited in DSBGA and may not achieve
2.1 W/Ch for 4 Ω. The maximum output power in the DSBGA is determined by the ability of the circuit board to remove heat. Figure 33 shows thermally limited region of the DSBGA in relation to the WQFN package. The TPA2012D2 provides thermal and short-circuit protection.

The TPA2012D2 is a stereo, filter-free, Class-D audio amplifier (Class-D amp) available in a DSBGA or WQFN package. The TPA2012D2 only requires two external components for operation.

The TPA2012D2 features independent shutdown controls for each channel. The gain can be selected to 6, 12, 18, or 24 dB using the G0 and G1 gain select pins. High PSRR and differential architecture provide increased immunity to noise and RF rectification. In addition to these features, a fast start-up time and small package size make the TPA2012D2 class-D amp an ideal choice for both cellular handsets and PDAs.

The TPA2012D2 is capable of driving 1.4 W/Ch at
5 V or 720 mW/Ch at 3.6 V into 8 Ω. The TPA2012D2 is also capable of driving 4 Ω. The TPA2012D2 is thermally limited in DSBGA and may not achieve
2.1 W/Ch for 4 Ω. The maximum output power in the DSBGA is determined by the ability of the circuit board to remove heat. Figure 33 shows thermally limited region of the DSBGA in relation to the WQFN package. The TPA2012D2 provides thermal and short-circuit protection.
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類型 標題 下載最新的英語版本 日期
* 數據表 TPA2012D2 2.1-W/Channel Stereo Filter-Free Class-D Audio Power Amplifier 數據表 (Rev. F) PDF | HTML 2017年 3月 14日
應用手冊 Guidelines for Measuring Audio Power Amplifier Performance (Rev. A) 2019年 8月 26日
應用手冊 AN-1849 An Audio Amplifier Power Supply Design (Rev. C) 2019年 6月 27日
應用手冊 AN-1737 Managing EMI in Class D Audio Applications (Rev. A) 2013年 5月 1日
更多文獻資料 TPA2012D2_NanoEVM_ Schematic 2007年 2月 13日
更多文獻資料 TPA2012D2_NanoEVM_OV 2007年 1月 29日
應用手冊 Measuring Class-D Amplifiers for Audio Speaker Overstress Testing 2005年 10月 28日
用戶指南 TPA2012D2EVM - User Guide (Rev. A) 2005年 4月 7日

設計和開發

如需其他信息或資源，請點擊以下任一標題進入詳情頁面查看（如有）。

評估板

CC3200AUDBOOST — SimpleLink Wi-Fi CC3200 音頻·BoosterPack

SimpleLink™ Wi-Fi® CC3200 音頻 BoosterPack 可借助 SimpleLink Wi-Fi CC3200 器件 上的數字音頻外設 [I2S] 實現評估和開發。BoosterPack 可與 SimpleLink Wi-Fi CC3200 Launchpad (CC3200-LAUNCHXL) 配合使用。它包含 D 類功率放大器，可以驅動揚聲器和超低功耗音頻編解碼器，即支持可編程音頻處理的 TLV320AIC3254。揚聲器、耳機和麥克風單獨銷售。SDK 中的示例應用需要兩個 CC3200 LaunchPad 和 CC3200AUDBOOST (...)

用戶指南: PDF
TI.com 上無現貨
評估板

TPA2012D2EVM — TPA2012D2 評估模塊 (EVM)

The TPA2012D2 EVM is a Pb-free, highly-efficient, filter-free stereo audio power amplifier evaluation module. It consists of the TI TPA2012D2 1.65 W low-voltage stereo Class-D audio power amplifier IC in a very small NanoFree™ wafer chip scale package (WCSP). All devices including the (...)

用戶指南: PDF
TI.com 上無現貨
仿真模型

TPA2012D2 PSpice Model

SLOM162.ZIP (6 KB) - PSpice Model
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仿真模型

TPA2012D2 TINA-TI Reference Design

SLOM160.TSC (37 KB) - TINA-TI Reference Design
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仿真模型

TPA2012D2 TINA-TI Spice Model

SLOM159.ZIP (22 KB) - TINA-TI Spice Model
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模擬工具

PSPICE-FOR-TI — PSpice? for TI 設計和仿真工具

PSpice? for TI 可提供幫助評估模擬電路功能的設計和仿真環境。此功能齊全的設計和仿真套件使用 Cadence? 的模擬分析引擎。PSpice for TI 可免費使用，包括業內超大的模型庫之一，涵蓋我們的模擬和電源產品系列以及精選的模擬行為模型。

借助?PSpice for TI 的設計和仿真環境及其內置的模型庫，您可對復雜的混合信號設計進行仿真。創建完整的終端設備設計和原型解決方案，然后再進行布局和制造，可縮短產品上市時間并降低開發成本。?

在?PSpice for TI 設計和仿真工具中，您可以搜索 TI (...)
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參考設計

TIDC-CC3200AUDBOOST — 用于 SimpleLink Wi-Fi CC3200 Launchpad 的 Wi-Fi 音頻流應用

此 SimpleLink Wi-Fi CC3200 LaunchPad 和音頻 BoosterPack 設計使新應用以及高清數字揚聲器等現有應用實現 Wi-Fi 音頻流功能。它可以實現從數字麥克風或立體聲/單聲道音頻插口到另一個啟用 Wi-Fi 的設備的音頻采集、流處理和回放。接收到的 Wi-Fi 音頻可以通過板載立體聲音頻插口或接線盒傳輸到立體聲或數字揚聲器。
原理圖: PDF
封裝 引腳 CAD 符號、封裝和 3D 模型
DSBGA (YZH) 16 Ultra Librarian
WQFN (RTJ) 20 Ultra Librarian

訂購和質量

包含信息：
  • RoHS
  • REACH
  • 器件標識
  • 引腳鍍層/焊球材料
  • MSL 等級/回流焊峰值溫度
  • MTBF/時基故障估算
  • 材料成分
  • 鑒定摘要
  • 持續可靠性監測
包含信息：
  • 制造廠地點
  • 封裝廠地點

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