TMP122-EP
- Digital Output: SPI-Compatible Interface
- Programmable Resolution: 9 to 12 Bits + Sign
- Aaccuracy: ±1.5°C from &150;25°C to 85°C (max) ±2.0°C from –55°C to 125°C (max)
- Low Quiescent Current: 50 μA
- Wide Supply Range: 2.7 V to 5.5 V
- Tiny SOT23-6 Package
- Operation to 150°C
- Programmable High/Low Setpoints
- APPLICATIONS
- Power-Supply Temperature Monitoring
- Computer Peripheral Thermal Protection
- Notebook Computers
- Cell Phones
- Battery Management
- Office Machines
- Thermostat Controls
- Environmental Monitoring and HVAC
- Electromechanical Device Temperature
- SUPPORTS DEFENSE, AEROSPACE, AND MEDICAL APPLICATIONS
- Controlled Baseline
- One Assembly/Test Site
- One Fabrication Site
- Available in Military (–55°C/125°C) Temperature Range(1)
- Extended Product Life Cycle
- Extended Product-Change Notification
- Product Traceability
(1) Additional temperature ranges are available - contact factory
SPI is a trademark of Motorola.
The TMP122 is an SPI-compatible temperature sensor available in an SOT23-6 package. Requiring only a pull-up resistor for complete function, the TMP122 temperature sensor is capable of measuring temperatures within 2°C of accuracy over a temperature range of 55°C to 125°C, with operation up to 150°C. Programmable resolution, programmable set points and shut down function provide versatility for any application. Low supply current and a supply range from 2.7 V to 5.5 V make the TMP122 an excellent candidate for low-power applications.
The TMP122 is ideal for extended thermal measurement in a variety of communication, computer, consumer, environmental, idustrial, and instrumentation applications.
技術(shù)文檔
| 類型 | 標(biāo)題 | 下載最新的英語版本 | 日期 | |||
|---|---|---|---|---|---|---|
| * | 數(shù)據(jù)表 | 1.5C Accurate Programmable Digital Temperature Sensors With SPI Interface 數(shù)據(jù)表 | 2008年 11月 17日 | |||
| * | VID | TMP122-EP VID V6209607 | 2016年 6月 21日 | |||
| * | 輻射與可靠性報(bào)告 | TMP122AMDBVTEP Reliability Report | 2011年 10月 21日 |
設(shè)計(jì)和開發(fā)
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| 封裝 | 引腳 | CAD 符號、封裝和 3D 模型 |
|---|---|---|
| SOT-23 (DBV) | 6 | Ultra Librarian |
訂購和質(zhì)量
- RoHS
- REACH
- 器件標(biāo)識
- 引腳鍍層/焊球材料
- MSL 等級/回流焊峰值溫度
- MTBF/時(shí)基故障估算
- 材料成分
- 鑒定摘要
- 持續(xù)可靠性監(jiān)測
- 制造廠地點(diǎn)
- 封裝廠地點(diǎn)