TMP121-EP
- Controlled Baseline
- One Assembly/Test Site, One Fabrication Site
- Extended Temperature Performance of -40°C to 125°C
- Enhanced Diminishing Manufacturing Sources (DMS) Support
- Enhanced Product-Change Notification
- Qualification Pedigree
- Digital Output: SPI-Compatible Interface
- Resolution: 12-Bit + Sign, 0.0625°C
- Accuracy: ±1.5°C from -25°C to 85°C (max)
- Low Quiescent Current: 50 μA (max)
- Wide Supply Range: 2.7 V to 5.5 V
- Tiny SOT23-6 Package
- Operation to 150°C
- APPLICATIONS
- Power-Supply Temperature Monitoring
- Computer Peripheral Thermal Protection
- Notebook Computers
- Battery Management
- Environmental Monitoring
(1)Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified
performance and environmental limits.
SPI is a trademark of Texas Instruments.
The TMP121 and TMP123 are SPI-compatible temperature sensors available in the tiny SOT23-6 package. Requiring no external components, the TMP121 and TMP123 are capable of measuring temperatures within 2°C of accuracy over a temperature range of -40°C to 125°C. Low supply current and a supply range from 2.7 V to 5.5 V make the TMP121 and TMP123 excellent candidates for low-power applications.
The TMP121 and TMP123 are ideal for extended thermal measurement in a variety of communication, computer, consumer, environmental, industrial, and instrumentation applications.
技術(shù)文檔
| 類型 | 標(biāo)題 | 下載最新的英語(yǔ)版本 | 日期 | |||
|---|---|---|---|---|---|---|
| * | 數(shù)據(jù)表 | 1.5 Degrees C Accurate Digital Temperature Sensor w/SPI Interface 數(shù)據(jù)表 | 2005年 9月 22日 | |||
| * | VID | TMP121-EP VID V6206608 | 2016年 6月 21日 | |||
| * | 輻射與可靠性報(bào)告 | TMP121AQDBVREP Reliability Report | 2012年 11月 6日 |
設(shè)計(jì)和開(kāi)發(fā)
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| 封裝 | 引腳 | CAD 符號(hào)、封裝和 3D 模型 |
|---|---|---|
| SOT-23 (DBV) | 6 | Ultra Librarian |
訂購(gòu)和質(zhì)量
- RoHS
- REACH
- 器件標(biāo)識(shí)
- 引腳鍍層/焊球材料
- MSL 等級(jí)/回流焊峰值溫度
- MTBF/時(shí)基故障估算
- 材料成分
- 鑒定摘要
- 持續(xù)可靠性監(jiān)測(cè)
- 制造廠地點(diǎn)
- 封裝廠地點(diǎn)