SN74LVC2G06
- Available in the Texas Instruments
Package - Supports 5-V VCC Operation
- Max tpd of 3.4 ns at 3.3 V
- Low Power Consumption, 10-μA Max ICC
- ±24-mA Output Drive at 3.3 V
- Typical VOLP (Output Ground Bounce)
<0.8 V at VCC = 3.3 V, TA = 25°C - Typical VOHV (Output VOH Undershoot)
>2 V at VCC = 3.3 V, TA = 25°C - Inputs and Open-Drain Outputs Accept
Voltages up to 5.5 V - Ioff Supports Live Insertion, Partial-Power-Down
Mode and Back-Drive Protection - Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II - Supports Down-Translation
(5 V to 3.3 V and 3.3 V to 1.8 V) - ESD Protection Exceeds JESD 22
- 2000-V Human Body Model (A114-A)
- 200-V Machine Model (A115-A)
- 1000-V Charged-Device Model (C101)
This dual inverter buffer and driver is designed for 1.65-V to 5.5-V VCC operation.
The output of the SN74LVC2G06 device is an open-drain which can be connected to other open-drain outputs to implement active-low, wired-OR, or active-high wired-AND functions. The maximum sink current is 32 mA.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.
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訂購(gòu)和質(zhì)量
- RoHS
- REACH
- 器件標(biāo)識(shí)
- 引腳鍍層/焊球材料
- MSL 等級(jí)/回流焊峰值溫度
- MTBF/時(shí)基故障估算
- 材料成分
- 鑒定摘要
- 持續(xù)可靠性監(jiān)測(cè)
- 制造廠地點(diǎn)
- 封裝廠地點(diǎn)