SN74LVC1G11-EP
- Available in the Texas Instruments NanoFree? Package
- Supports 5-V VCC Operation
- Inputs Accept Voltages to 5.5 V
- Max tpd of 5.9 ns at 3.3 V
- Low Power Consumption, 10-μA Max ICC
- ±24-mA Output Drive at 3.3 V
- Ioff Supports Partial-Power-Down Mode Operation
- Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
- ESD Protection Exceeds JESD 22
- 2000-V Human-Body Model (A114-A)
- 200-V Machine Model (A115-A)
- 1000-V Charged-Device Model (C101)
- SUPPORTS DEFENSE, AEROSPACE, AND MEDICAL APPLICATIONS
- Controlled Baseline
- One Assembly/Test Site
- One Fabrication Site
- Available in Military (–55°C/125°C) Temperature Range(1)
- Extended Product Life Cycle
- Extended Product-Change Notification
- Product Traceability
(1) Additional temperature ranges are available - contact factory
NanoFree Is a trademark of Texas Instruments.
The SN74LVC1G11 performs the Boolean function Y = A • B • C or Y = A\ + B\ + C\ in positive logic.
NanoFree package technology is a major breakthrough in IC packaging concepts, using the die as the package.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.
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| 封裝 | 引腳 | CAD 符號(hào)、封裝和 3D 模型 |
|---|---|---|
| SOT-SC70 (DCK) | 6 | Ultra Librarian |
訂購(gòu)和質(zhì)量
包含信息:
- RoHS
- REACH
- 器件標(biāo)識(shí)
- 引腳鍍層/焊球材料
- MSL 等級(jí)/回流焊峰值溫度
- MTBF/時(shí)基故障估算
- 材料成分
- 鑒定摘要
- 持續(xù)可靠性監(jiān)測(cè)
包含信息:
- 制造廠地點(diǎn)
- 封裝廠地點(diǎn)