產(chǎn)品詳情

Bits (#) 8 Data rate (max) (Mbps) 350 Topology Open drain, Push-Pull Direction control (typ) Direction-controlled Vin (min) (V) 3.15 Vin (max) (V) 3.45 Vout (min) (V) 3.15 Vout (max) (V) 3.45 Applications GTL Features Overvoltage tolerant inputs, Partial power down (Ioff) Technology family GTLP Supply current (max) (mA) 20 Rating Catalog Operating temperature range (°C) -40 to 85
Bits (#) 8 Data rate (max) (Mbps) 350 Topology Open drain, Push-Pull Direction control (typ) Direction-controlled Vin (min) (V) 3.15 Vin (max) (V) 3.45 Vout (min) (V) 3.15 Vout (max) (V) 3.45 Applications GTL Features Overvoltage tolerant inputs, Partial power down (Ioff) Technology family GTLP Supply current (max) (mA) 20 Rating Catalog Operating temperature range (°C) -40 to 85
SOIC (DW) 24 159.65 mm2 15.5 x 10.3 TSSOP (PW) 24 49.92 mm2 7.8 x 6.4 TVSOP (DGV) 24 32 mm2 5 x 6.4
  • TI-OPC? Circuitry Limits Ringing on Unevenly Loaded Backplanes
  • OEC? Circuitry Improves Signal Integrity and Reduces Electromagnetic Interference
  • Bidirectional Interface Between GTLP Signal Levels and LVTTL Logic Levels
  • LVTTL Interfaces Are 5-V Tolerant
  • Medium-Drive GTLP Outputs (50 mA)
  • LVTTL Outputs (\x9624 mA/24 mA)
  • GTLP Rise and Fall Times Designed for Optimal Data-Transfer Rate and Signal Integrity in Distributed Loads
  • Ioff and Power-Up 3-State Support Hot Insertion
  • Bus Hold on A-Port Data Inputs
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model (A114-A)
    • 200-V Machine Model (A115-A)
    • 1000-V Charged-Device Model (C101)

OEC, TI, and TI-OPC are trademarks of Texas Instruments.

  • TI-OPC? Circuitry Limits Ringing on Unevenly Loaded Backplanes
  • OEC? Circuitry Improves Signal Integrity and Reduces Electromagnetic Interference
  • Bidirectional Interface Between GTLP Signal Levels and LVTTL Logic Levels
  • LVTTL Interfaces Are 5-V Tolerant
  • Medium-Drive GTLP Outputs (50 mA)
  • LVTTL Outputs (\x9624 mA/24 mA)
  • GTLP Rise and Fall Times Designed for Optimal Data-Transfer Rate and Signal Integrity in Distributed Loads
  • Ioff and Power-Up 3-State Support Hot Insertion
  • Bus Hold on A-Port Data Inputs
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model (A114-A)
    • 200-V Machine Model (A115-A)
    • 1000-V Charged-Device Model (C101)

OEC, TI, and TI-OPC are trademarks of Texas Instruments.

The SN74GTLPH306 is a medium-drive, 8-bit bus transceiver that provides LVTTL-to-GTLP and GTLP-to-LVTTL signal-level translation. The device provides a high-speed interface between cards operating at LVTTL logic levels and a backplane operating at GTLP signal levels. High-speed (about three times faster than standard LVTTL or TTL) backplane operation is a direct result of GTLP's reduced output swing (<1 V), reduced input threshold levels, improved differential input, OEC™ circuitry, and TI-OPC™ circuitry. Improved GTLP OEC and TI-OPC circuits minimize bus-settling time and have been designed and tested using several backplane models. The medium drive allows incident-wave switching in heavily loaded backplanes with equivalent load impedance down to 19 .

GTLP is the Texas Instruments (TI™) derivative of the Gunning Transceiver Logic (GTL) JEDEC standard JESD 8-3. The ac specification of the SN74GTLPH306 is given only at the preferred higher-noise-margin GTLP, but the user has the flexibility of using this device at either GTL (VTT = 1.2 V and VREF = 0.8 V) or GTLP (VTT = 1.5 V and VREF = 1 V) signal levels.

Normally, the B port operates at GTLP signal levels. The A-port and control inputs operate at LVTTL logic levels, but are 5-V tolerant and are compatible with TTL and 5-V CMOS inputs. VREF is the B-port differential input reference voltage.

This device is fully specified for hot-insertion applications using Ioff and power-up 3-state. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. The power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down, which prevents driver conflict.

This GTLP device features TI-OPC circuitry, which actively limits overshoot caused by improperly terminated backplanes, unevenly distributed cards, or empty slots during low-to-high signal transitions. This improves signal integrity, which allows adequate noise margin to be maintained at higher frequencies.

Active bus-hold circuitry holds unused or undriven LVTTL data inputs at a valid logic state. Use of pullup or pulldown resistors with the bus-hold circuitry is not recommended.

When VCC is between 0 and 1.5 V, the device is in the high-impedance state during power up or power down. However, to ensure the high-impedance state above 1.5 V, the output-enable (OE\) input should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

The SN74GTLPH306 is a medium-drive, 8-bit bus transceiver that provides LVTTL-to-GTLP and GTLP-to-LVTTL signal-level translation. The device provides a high-speed interface between cards operating at LVTTL logic levels and a backplane operating at GTLP signal levels. High-speed (about three times faster than standard LVTTL or TTL) backplane operation is a direct result of GTLP's reduced output swing (<1 V), reduced input threshold levels, improved differential input, OEC™ circuitry, and TI-OPC™ circuitry. Improved GTLP OEC and TI-OPC circuits minimize bus-settling time and have been designed and tested using several backplane models. The medium drive allows incident-wave switching in heavily loaded backplanes with equivalent load impedance down to 19 .

GTLP is the Texas Instruments (TI™) derivative of the Gunning Transceiver Logic (GTL) JEDEC standard JESD 8-3. The ac specification of the SN74GTLPH306 is given only at the preferred higher-noise-margin GTLP, but the user has the flexibility of using this device at either GTL (VTT = 1.2 V and VREF = 0.8 V) or GTLP (VTT = 1.5 V and VREF = 1 V) signal levels.

Normally, the B port operates at GTLP signal levels. The A-port and control inputs operate at LVTTL logic levels, but are 5-V tolerant and are compatible with TTL and 5-V CMOS inputs. VREF is the B-port differential input reference voltage.

This device is fully specified for hot-insertion applications using Ioff and power-up 3-state. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. The power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down, which prevents driver conflict.

This GTLP device features TI-OPC circuitry, which actively limits overshoot caused by improperly terminated backplanes, unevenly distributed cards, or empty slots during low-to-high signal transitions. This improves signal integrity, which allows adequate noise margin to be maintained at higher frequencies.

Active bus-hold circuitry holds unused or undriven LVTTL data inputs at a valid logic state. Use of pullup or pulldown resistors with the bus-hold circuitry is not recommended.

When VCC is between 0 and 1.5 V, the device is in the high-impedance state during power up or power down. However, to ensure the high-impedance state above 1.5 V, the output-enable (OE\) input should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

下載 觀看帶字幕的視頻 視頻

技術(shù)文檔

star =有關(guān)此產(chǎn)品的 TI 精選熱門文檔
未找到結(jié)果。請清除搜索并重試。
查看全部 20
類型 標題 下載最新的英語版本 日期
* 數(shù)據(jù)表 8-Bit LVTTL-to-GTL+ Bus Transceiver 數(shù)據(jù)表 (Rev. E) 2001年 8月 14日
應(yīng)用手冊 原理圖檢查清單 - 使用自動雙向轉(zhuǎn)換器進行設(shè)計的指南 PDF | HTML 英語版 PDF | HTML 2024年 12月 3日
應(yīng)用手冊 Understanding Transient Drive Strength vs. DC Drive Strength in Level-Shifters (Rev. A) PDF | HTML 2024年 7月 3日
應(yīng)用手冊 了解 CMOS 輸出緩沖器中的瞬態(tài)驅(qū)動強度與直流驅(qū)動強度 PDF | HTML 最新英語版本 (Rev.A) PDF | HTML 2024年 5月 15日
選擇指南 Voltage Translation Buying Guide (Rev. A) 2021年 4月 15日
選擇指南 Logic Guide (Rev. AB) 2017年 6月 12日
應(yīng)用手冊 Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 2015年 12月 2日
選擇指南 邏輯器件指南 2014 (Rev. AA) 最新英語版本 (Rev.AC) PDF | HTML 2014年 11月 17日
選擇指南 《高級總線接口邏輯器件選擇指南》 英語版 2010年 7月 7日
用戶指南 LOGIC Pocket Data Book (Rev. B) 2007年 1月 16日
應(yīng)用手冊 Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 2004年 7月 8日
應(yīng)用手冊 TI IBIS File Creation, Validation, and Distribution Processes 2002年 8月 29日
應(yīng)用手冊 Power-Up 3-State (PU3S) Circuits in TI Standard Logic Devices 2002年 5月 10日
應(yīng)用手冊 Logic in Live-Insertion Applications With a Focus on GTLP 2002年 1月 14日
用戶指南 GTLP/GTL Logic High-Performance Backplane Drivers Data Book (Rev. A) 2001年 9月 15日
應(yīng)用手冊 Achieving Maximum Speed on Parallel Buses With Gunning Transceiver Logic (GTLP) 2001年 4月 5日
應(yīng)用簡報 Texas Instruments GTLP Frequently Asked Questions 2001年 1月 1日
應(yīng)用手冊 Fast GTLP Backplanes With the GTLPH1655 (Rev. A) 2000年 9月 19日
更多文獻資料 High Level Brochure of Gunning Transceiver Logic Plus 2000年 1月 14日
選擇指南 Logic Guide (Rev. AC) PDF | HTML 1994年 6月 1日

設(shè)計和開發(fā)

如需其他信息或資源,請點擊以下任一標題進入詳情頁面查看(如有)。

評估板

14-24-LOGIC-EVM — 采用 14 引腳至 24 引腳 D、DB、DGV、DW、DYY、NS 和 PW 封裝的邏輯產(chǎn)品通用評估模塊

14-24-LOGIC-EVM 評估模塊 (EVM) 設(shè)計用于支持采用 14 引腳至 24 引腳 D、DW、DB、NS、PW、DYY 或 DGV 封裝的任何邏輯器件。

用戶指南: PDF | HTML
英語版 (Rev.B): PDF | HTML
TI.com 上無現(xiàn)貨
仿真模型

SN74GTLPH306 IBIS Model

SCEM202.ZIP (24 KB) - IBIS Model
封裝 引腳 CAD 符號、封裝和 3D 模型
SOIC (DW) 24 Ultra Librarian
TSSOP (PW) 24 Ultra Librarian
TVSOP (DGV) 24 Ultra Librarian

訂購和質(zhì)量

包含信息:
  • RoHS
  • REACH
  • 器件標識
  • 引腳鍍層/焊球材料
  • MSL 等級/回流焊峰值溫度
  • MTBF/時基故障估算
  • 材料成分
  • 鑒定摘要
  • 持續(xù)可靠性監(jiān)測
包含信息:
  • 制造廠地點
  • 封裝廠地點

支持和培訓(xùn)

視頻