產(chǎn)品詳情

Bits (#) 16 Data rate (max) (Mbps) 350 Topology Open drain, Push-Pull Direction control (typ) Direction-controlled Vin (min) (V) 3.15 Vin (max) (V) 3.45 Vout (min) (V) 3.15 Vout (max) (V) 3.45 Applications GTL Features Overvoltage tolerant inputs, Partial power down (Ioff) Technology family GTLP Supply current (max) (mA) 50 Rating Catalog Operating temperature range (°C) -40 to 85
Bits (#) 16 Data rate (max) (Mbps) 350 Topology Open drain, Push-Pull Direction control (typ) Direction-controlled Vin (min) (V) 3.15 Vin (max) (V) 3.45 Vout (min) (V) 3.15 Vout (max) (V) 3.45 Applications GTL Features Overvoltage tolerant inputs, Partial power down (Ioff) Technology family GTLP Supply current (max) (mA) 50 Rating Catalog Operating temperature range (°C) -40 to 85
TSSOP (DGG) 48 101.25 mm2 12.5 x 8.1
  • Member of the Texas Instruments Widebus? Family
  • TI-OPC? Circuitry Limits Ringing on Unevenly Loaded Backplanes
  • OEC? Circuitry Improves Signal Integrity and Reduces Electromagnetic Interference
  • Bidirectional Interface Between GTLP Signal Levels and LVTTL Logic Levels
  • LVTTL Interfaces Are 5-V Tolerant
  • Medium-Drive GTLP Outputs (50 mA)
  • LVTTL Outputs (–24 mA/24 mA)
  • GTLP Rise and Fall Times Designed for Optimal Data-Transfer Rate and Signal Integrity in Distributed Loads
  • Ioff, Power-Up 3-State, and BIAS VCC Support Live Insertion
  • Bus Hold on A-Port Data Inputs
  • Distributed VCC and GND Pins Minimize High-Speed Switching Noise
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II

OEC, TI-OPC, and Widebus are trademarks of Texas Instruments.

  • Member of the Texas Instruments Widebus? Family
  • TI-OPC? Circuitry Limits Ringing on Unevenly Loaded Backplanes
  • OEC? Circuitry Improves Signal Integrity and Reduces Electromagnetic Interference
  • Bidirectional Interface Between GTLP Signal Levels and LVTTL Logic Levels
  • LVTTL Interfaces Are 5-V Tolerant
  • Medium-Drive GTLP Outputs (50 mA)
  • LVTTL Outputs (–24 mA/24 mA)
  • GTLP Rise and Fall Times Designed for Optimal Data-Transfer Rate and Signal Integrity in Distributed Loads
  • Ioff, Power-Up 3-State, and BIAS VCC Support Live Insertion
  • Bus Hold on A-Port Data Inputs
  • Distributed VCC and GND Pins Minimize High-Speed Switching Noise
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II

OEC, TI-OPC, and Widebus are trademarks of Texas Instruments.

The SN74GTLPH16945 is a medium-drive, 16-bit bus transceiver that provides LVTTL-to-GTLP and GTLP-to-LVTTL signal-level translation. It is partitioned as two 8-bit transceivers. The device provides a high-speed interface between cards operating at LVTTL logic levels and a backplane operating at GTLP signal levels. High-speed (about three times faster than standard TTL or LVTTL) backplane operation is a direct result of GTLP’s reduced output swing (<1 V), reduced input threshold levels, improved differential input, OEC™ circuitry, and TI-OPC™ circuitry. Improved GTLP OEC and TI-OPC circuits minimize bus-settling time and have been designed and tested using several backplane models. The medium drive allows incident-wave switching in heavily loaded backplanes with equivalent load impedance down to 19 .

GTLP is the Texas Instruments derivative of the Gunning Transceiver Logic (GTL) JEDEC standard JESD 8-3. The ac specification of the SN74GTLPH16945 is given only at the preferred higher noise margin GTLP, but the user has the flexibility of using this device at either GTL (VTT = 1.2 V and VREF = 0.8 V) or GTLP (VTT = 1.5 V and VREF = 1 V) signal levels.

Normally, the B port operates at GTLP signal levels. The A-port and control inputs operate at LVTTL logic levels but are 5-V tolerant and are compatible with TTL and 5-V CMOS inputs. VREF is the B-port differential input reference voltage.

This device is fully specified for live-insertion applications using Ioff, power-up 3-state, and BIAS VCC. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. The power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down, which prevents driver conflict. The BIAS VCC circuitry precharges and preconditions the B-port input/output connections, preventing disturbance of active data on the backplane during card insertion or removal, and permits true live-insertion capability.

This GTLP device features TI-OPC circuitry, which actively limits overshoot caused by improperly terminated backplanes, unevenly distributed cards, or empty slots during low-to-high signal transitions. This improves signal integrity, which allows adequate noise margin to be maintained at higher frequencies.

Active bus-hold circuitry holds unused or undriven LVTTL data inputs at a valid logic state. Use of pullup or pulldown resistors with the bus-hold circuitry is not recommended.

When VCC is between 0 and 1.5 V, the device is in the high-impedance state during power up or power down. However, to ensure the high-impedance state above 1.5 V, the output-enable (OE\) input should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

The SN74GTLPH16945 is a medium-drive, 16-bit bus transceiver that provides LVTTL-to-GTLP and GTLP-to-LVTTL signal-level translation. It is partitioned as two 8-bit transceivers. The device provides a high-speed interface between cards operating at LVTTL logic levels and a backplane operating at GTLP signal levels. High-speed (about three times faster than standard TTL or LVTTL) backplane operation is a direct result of GTLP’s reduced output swing (<1 V), reduced input threshold levels, improved differential input, OEC™ circuitry, and TI-OPC™ circuitry. Improved GTLP OEC and TI-OPC circuits minimize bus-settling time and have been designed and tested using several backplane models. The medium drive allows incident-wave switching in heavily loaded backplanes with equivalent load impedance down to 19 .

GTLP is the Texas Instruments derivative of the Gunning Transceiver Logic (GTL) JEDEC standard JESD 8-3. The ac specification of the SN74GTLPH16945 is given only at the preferred higher noise margin GTLP, but the user has the flexibility of using this device at either GTL (VTT = 1.2 V and VREF = 0.8 V) or GTLP (VTT = 1.5 V and VREF = 1 V) signal levels.

Normally, the B port operates at GTLP signal levels. The A-port and control inputs operate at LVTTL logic levels but are 5-V tolerant and are compatible with TTL and 5-V CMOS inputs. VREF is the B-port differential input reference voltage.

This device is fully specified for live-insertion applications using Ioff, power-up 3-state, and BIAS VCC. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. The power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down, which prevents driver conflict. The BIAS VCC circuitry precharges and preconditions the B-port input/output connections, preventing disturbance of active data on the backplane during card insertion or removal, and permits true live-insertion capability.

This GTLP device features TI-OPC circuitry, which actively limits overshoot caused by improperly terminated backplanes, unevenly distributed cards, or empty slots during low-to-high signal transitions. This improves signal integrity, which allows adequate noise margin to be maintained at higher frequencies.

Active bus-hold circuitry holds unused or undriven LVTTL data inputs at a valid logic state. Use of pullup or pulldown resistors with the bus-hold circuitry is not recommended.

When VCC is between 0 and 1.5 V, the device is in the high-impedance state during power up or power down. However, to ensure the high-impedance state above 1.5 V, the output-enable (OE\) input should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

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類型 標(biāo)題 下載最新的英語版本 日期
* 數(shù)據(jù)表 16-Bit LVTTL-to-GTLP Bus Transceiver 數(shù)據(jù)表 (Rev. D) 2001年 11月 29日
應(yīng)用手冊 原理圖檢查清單 - 使用自動雙向轉(zhuǎn)換器進(jìn)行設(shè)計的指南 PDF | HTML 英語版 PDF | HTML 2024年 12月 3日
應(yīng)用手冊 Understanding Transient Drive Strength vs. DC Drive Strength in Level-Shifters (Rev. A) PDF | HTML 2024年 7月 3日
應(yīng)用手冊 了解 CMOS 輸出緩沖器中的瞬態(tài)驅(qū)動強(qiáng)度與直流驅(qū)動強(qiáng)度 PDF | HTML 最新英語版本 (Rev.A) PDF | HTML 2024年 5月 15日
選擇指南 Voltage Translation Buying Guide (Rev. A) 2021年 4月 15日
選擇指南 Logic Guide (Rev. AB) 2017年 6月 12日
應(yīng)用手冊 Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 2015年 12月 2日
選擇指南 邏輯器件指南 2014 (Rev. AA) 最新英語版本 (Rev.AC) PDF | HTML 2014年 11月 17日
選擇指南 《高級總線接口邏輯器件選擇指南》 英語版 2010年 7月 7日
用戶指南 LOGIC Pocket Data Book (Rev. B) 2007年 1月 16日
應(yīng)用手冊 Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 2004年 7月 8日
應(yīng)用手冊 TI IBIS File Creation, Validation, and Distribution Processes 2002年 8月 29日
應(yīng)用手冊 Power-Up 3-State (PU3S) Circuits in TI Standard Logic Devices 2002年 5月 10日
應(yīng)用手冊 Logic in Live-Insertion Applications With a Focus on GTLP 2002年 1月 14日
用戶指南 GTLP/GTL Logic High-Performance Backplane Drivers Data Book (Rev. A) 2001年 9月 15日
應(yīng)用手冊 Achieving Maximum Speed on Parallel Buses With Gunning Transceiver Logic (GTLP) 2001年 4月 5日
應(yīng)用簡報 Texas Instruments GTLP Frequently Asked Questions 2001年 1月 1日
應(yīng)用手冊 Fast GTLP Backplanes With the GTLPH1655 (Rev. A) 2000年 9月 19日
更多文獻(xiàn)資料 High Level Brochure of Gunning Transceiver Logic Plus 2000年 1月 14日
選擇指南 Logic Guide (Rev. AC) PDF | HTML 1994年 6月 1日

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