產品詳情

Technology family AUP Supply voltage (min) (V) 0.8 Supply voltage (max) (V) 3.6 Number of channels 3 IOL (max) (mA) 4 Supply current (max) (μA) 0.9 IOH (max) (mA) -4 Input type Standard CMOS Output type Push-Pull Features Balanced outputs, Over-voltage tolerant inputs, Partial power down (Ioff), Very high speed (tpd 5-10ns) Rating Catalog Operating temperature range (°C) -40 to 85
Technology family AUP Supply voltage (min) (V) 0.8 Supply voltage (max) (V) 3.6 Number of channels 3 IOL (max) (mA) 4 Supply current (max) (μA) 0.9 IOH (max) (mA) -4 Input type Standard CMOS Output type Push-Pull Features Balanced outputs, Over-voltage tolerant inputs, Partial power down (Ioff), Very high speed (tpd 5-10ns) Rating Catalog Operating temperature range (°C) -40 to 85
DSBGA (YFP) 8 1.8 mm2 1 x 1.8 UQFN (RSE) 8 2.25 mm2 1.5 x 1.5 VSSOP (DCU) 8 6.2 mm2 2 x 3.1 X2SON (DQE) 8 1.4 mm2 1.4 x 1
  • Available in the Texas Instruments NanoStar? Package
  • Low Static-Power Consumption
    (ICC = 0.9 μA Maximum)
  • Low Dynamic-Power Consumption
    (Cpd = 4.3 pF Typ at 3.3 V)
  • Low Input Capacitance (Ci = 1.5 pF Typical)
  • Low Noise – Overshoot and Undershoot
    <10% of VCC
  • Ioff Supports Partial-Power-Down Mode Operation
  • Wide Operating VCC Range of 0.8 V to 3.6 V
  • Optimized for 3.3-V Operation
  • 3.6-V I/O Tolerant to Support Mixed-Mode Signal Operation
  • tpd = 4.3 ns Maximum at 3.3 V
  • Suitable for Point-to-Point Applications
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Performance Tested Per JESD 22
    • 2000-V Human-Body Model
      (A114-B, Class II)
    • 1000-V Charged-Device Model (C101)

NanoStar Is a trademark of Texas Instruments
  • Available in the Texas Instruments NanoStar? Package
  • Low Static-Power Consumption
    (ICC = 0.9 μA Maximum)
  • Low Dynamic-Power Consumption
    (Cpd = 4.3 pF Typ at 3.3 V)
  • Low Input Capacitance (Ci = 1.5 pF Typical)
  • Low Noise – Overshoot and Undershoot
    <10% of VCC
  • Ioff Supports Partial-Power-Down Mode Operation
  • Wide Operating VCC Range of 0.8 V to 3.6 V
  • Optimized for 3.3-V Operation
  • 3.6-V I/O Tolerant to Support Mixed-Mode Signal Operation
  • tpd = 4.3 ns Maximum at 3.3 V
  • Suitable for Point-to-Point Applications
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Performance Tested Per JESD 22
    • 2000-V Human-Body Model
      (A114-B, Class II)
    • 1000-V Charged-Device Model (C101)

NanoStar Is a trademark of Texas Instruments

The AUP family is TI’s premier solution to the industry’s low-power needs in battery-powered portable applications. This family ensures a very low static- and dynamic-power consumption across the entire VCC range of 0.8 V to 3.6 V, resulting in increased battery life (see Figure 1). This product also maintains excellent signal integrity (see the very low undershoot and overshoot characteristics shown in Figure 2).

The SN74AUP3G34 performs the Boolean function Y = A in positive logic.

NanoStar™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

The AUP family is TI’s premier solution to the industry’s low-power needs in battery-powered portable applications. This family ensures a very low static- and dynamic-power consumption across the entire VCC range of 0.8 V to 3.6 V, resulting in increased battery life (see Figure 1). This product also maintains excellent signal integrity (see the very low undershoot and overshoot characteristics shown in Figure 2).

The SN74AUP3G34 performs the Boolean function Y = A in positive logic.

NanoStar™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.
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技術文檔

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類型 標題 下載最新的英語版本 日期
* 數據表 SN74AUP3G34 Low-Power Triple Buffer Gate 數據表 (Rev. C) 2012年 2月 3日
應用簡報 了解施密特觸發器 (Rev. B) PDF | HTML 英語版 (Rev.B) PDF | HTML 2025年 5月 5日
選擇指南 Little Logic Guide 2018 (Rev. G) 2018年 7月 6日
選擇指南 Logic Guide (Rev. AB) 2017年 6月 12日
應用手冊 How to Select Little Logic (Rev. A) 2016年 7月 26日
選擇指南 邏輯器件指南 2014 (Rev. AA) 最新英語版本 (Rev.AC) PDF | HTML 2014年 11月 17日
選擇指南 小尺寸邏輯器件指南 (Rev. E) 最新英語版本 (Rev.G) 2012年 7月 16日
應用手冊 Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 2004年 7月 8日
選擇指南 Logic Guide (Rev. AC) PDF | HTML 1994年 6月 1日

設計和開發

如需其他信息或資源，請點擊以下任一標題進入詳情頁面查看（如有）。

評估板

5-8-LOGIC-EVM — 支持 5 至 8 引腳 DCK、DCT、DCU、DRL 和 DBV 封裝的通用邏輯評估模塊

靈活的 EVM 設計用于支持具有 5 至 8 引腳數且采用 DCK、DCT、DCU、DRL 或 DBV 封裝的任何器件。
用戶指南: PDF
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仿真模型

SN74AUP3G34 Behavioral SPICE Model

SCEM664.ZIP (7 KB) - PSpice Model
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封裝 引腳 CAD 符號、封裝和 3D 模型
DSBGA (YFP) 8 Ultra Librarian
UQFN (RSE) 8 Ultra Librarian
VSSOP (DCU) 8 Ultra Librarian
X2SON (DQE) 8 Ultra Librarian

訂購和質量

包含信息：
  • RoHS
  • REACH
  • 器件標識
  • 引腳鍍層/焊球材料
  • MSL 等級/回流焊峰值溫度
  • MTBF/時基故障估算
  • 材料成分
  • 鑒定摘要
  • 持續可靠性監測
包含信息：
  • 制造廠地點
  • 封裝廠地點

支持和培訓

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