SN74AUC1G74
- Available in the Texas Instruments NanoFree? Package
- Optimized for 1.8-V Operation and Is 3.6-V I/O Tolerant to Support Mixed-Mode Signal Operation
- Ioff Supports Partial-Power-Down Mode Operation
- Sub-1-V Operable
- Max tpd of 1.5 ns at 1.8 V
- Low Power Consumption, 10-μA Max ICC
- ±8-mA Output Drive at 1.8 V
- Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
- ESD Protection Exceeds JESD 22
- 2000-V Human-Body Model (A114-A)
- 200-V Machine Model (A115-A)
- 1000-V Charged-Device Model (C101)
NanoFree Is a trademark of Texas Instruments
This single positive-edge-triggered D-type flip-flop is operational at 0.8-V to 2.7-V VCC, but is designed specifically for 1.65-V to 1.95-V VCC operation.
A low level at the preset (PRE) or clear (CLR) input sets or resets the outputs, regardless of the levels of the other inputs. When PRE and CLR are inactive (high), data at the data (D) input meeting the setup time requirements is transferred to the outputs on the positive-going edge of the clock pulse. Clock triggering occurs at a voltage level and is not related directly to the rise time of the clock pulse. Following the hold-time interval, data at the D input can be changed without affecting the levels at the outputs. To better optimize the flip-flop for higher frequencies, the CLR input overrides the PRE input when they are both low.
NanoFree package technology is a major breakthrough in IC packaging concepts, using the die as the package.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.
技術文檔
設計和開發
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5-8-LOGIC-EVM — 支持 5 至 8 引腳 DCK、DCT、DCU、DRL 和 DBV 封裝的通用邏輯評估模塊
| 封裝 | 引腳 | CAD 符號、封裝和 3D 模型 |
|---|---|---|
| DSBGA (YZP) | 8 | Ultra Librarian |
| SSOP (DCT) | 8 | Ultra Librarian |
| UQFN (RSE) | 8 | Ultra Librarian |
| VSSOP (DCU) | 8 | Ultra Librarian |
訂購和質量
- RoHS
- REACH
- 器件標識
- 引腳鍍層/焊球材料
- MSL 等級/回流焊峰值溫度
- MTBF/時基故障估算
- 材料成分
- 鑒定摘要
- 持續可靠性監測
- 制造廠地點
- 封裝廠地點