SN74AHCT244-EP

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具有 TTL 兼容型 CMOS 輸入的 8 通道、4.5V 至 5.5V 緩沖器（增強(qiáng)型產(chǎn)品）

產(chǎn)品詳情

Technology family AHCT Supply voltage (min) (V) 4.5 Supply voltage (max) (V) 5.5 Number of channels 8 IOL (max) (mA) 8 Supply current (max) (μA) 40 IOH (max) (mA) -8 Input type TTL-Compatible CMOS Output type Push-Pull Features Balanced outputs, Over-voltage tolerant inputs, Very high speed (tpd 5-10ns) Rating HiRel Enhanced Product Operating temperature range (°C) -55 to 125
Technology family AHCT Supply voltage (min) (V) 4.5 Supply voltage (max) (V) 5.5 Number of channels 8 IOL (max) (mA) 8 Supply current (max) (μA) 40 IOH (max) (mA) -8 Input type TTL-Compatible CMOS Output type Push-Pull Features Balanced outputs, Over-voltage tolerant inputs, Very high speed (tpd 5-10ns) Rating HiRel Enhanced Product Operating temperature range (°C) -55 to 125
SOIC (DW) 20 131.84 mm2 12.8 x 10.3 TSSOP (PW) 20 41.6 mm2 6.5 x 6.4
  • Controlled Baseline
    • One Assembly/Test Site, One Fabrication Site
  • Extended Temperature Performance of –55°C to 125°C
  • Enhanced Diminishing Manufacturing Sources (DMS) Support
  • Enhanced Product-Change Notification
  • Qualification Pedigree
  • EPIC? (Enhanced-Performance Implanted CMOS) Process
  • Inputs Are TTL-Voltage Compatible
  • Latch-Up Performance Exceeds 250 mA Per JESD 17
  • ESD Protection Exceeds 1000 V Per MIL-STD-833, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)

Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits.

EPIC is a trademark of Texas Instruments.
  • Controlled Baseline
    • One Assembly/Test Site, One Fabrication Site
  • Extended Temperature Performance of –55°C to 125°C
  • Enhanced Diminishing Manufacturing Sources (DMS) Support
  • Enhanced Product-Change Notification
  • Qualification Pedigree
  • EPIC? (Enhanced-Performance Implanted CMOS) Process
  • Inputs Are TTL-Voltage Compatible
  • Latch-Up Performance Exceeds 250 mA Per JESD 17
  • ESD Protection Exceeds 1000 V Per MIL-STD-833, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)

Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits.

EPIC is a trademark of Texas Instruments.

This octal buffer/driver is designed specifically to improve both the performance and density of 3-state memory-address drivers, clock drivers, and bus-oriented receivers and transmitters.

The SN74AHCT244 is organized as two 4-bit buffers/line drivers with separate output-enable (OE)\ inputs. When OE\ is low, the device passes data from the A inputs to the Y outputs. When OE\ is high, the outputs are in the high-impedance state.

To ensure the high-impedance state during power up or power down, OE\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

This octal buffer/driver is designed specifically to improve both the performance and density of 3-state memory-address drivers, clock drivers, and bus-oriented receivers and transmitters.

The SN74AHCT244 is organized as two 4-bit buffers/line drivers with separate output-enable (OE)\ inputs. When OE\ is low, the device passes data from the A inputs to the Y outputs. When OE\ is high, the outputs are in the high-impedance state.

To ensure the high-impedance state during power up or power down, OE\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
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頂層文檔 類型 標(biāo)題 格式選項 下載最新的英語版本 日期
* 數(shù)據(jù)表 SN74AHCT244-EP 數(shù)據(jù)表 (Rev. A) 2003年 5月 30日
* VID SN74AHCT244-EP VID V6203657 2016年 6月 21日
選擇指南 Logic Guide (Rev. AC) PDF | HTML 2025年 11月 13日
應(yīng)用手冊 慢速或浮點 CMOS 輸入的影響 (Rev. E) PDF | HTML 英語版 (Rev.E) 2025年 3月 26日
選擇指南 Little Logic Guide 2018 (Rev. G) 2018年 7月 6日
應(yīng)用手冊 How to Select Little Logic (Rev. A) 2016年 7月 26日
應(yīng)用手冊 Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 2015年 12月 2日
選擇指南 邏輯器件指南 2014 (Rev. AA) 最新英語版本 (Rev.AC) PDF | HTML 2014年 11月 17日
選擇指南 小尺寸邏輯器件指南 (Rev. E) 最新英語版本 (Rev.G) 2012年 7月 16日
用戶指南 LOGIC Pocket Data Book (Rev. B) 2007年 1月 16日
應(yīng)用手冊 選擇正確的電平轉(zhuǎn)換解決方案 (Rev. A) 英語版 (Rev.A) 2006年 3月 23日
產(chǎn)品概述 Design Summary for WCSP Little Logic (Rev. B) 2004年 11月 4日
應(yīng)用手冊 Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 2004年 7月 8日
應(yīng)用手冊 Advanced High-Speed CMOS (AHC) Logic Family (Rev. C) 2002年 12月 2日
應(yīng)用手冊 Texas Instruments Little Logic Application Report 2002年 11月 1日
應(yīng)用手冊 TI IBIS File Creation, Validation, and Distribution Processes 2002年 8月 29日
設(shè)計指南 AHC/AHCT Designer's Guide February 2000 (Rev. D) 2000年 2月 24日
產(chǎn)品概述 Military Advanced High-Speed CMOS Logic (AHC/AHCT) (Rev. C) 1998年 4月 1日
應(yīng)用手冊 Migration From 3.3-V To 2.5-V Power Supplies For Logic Devices 1997年 12月 1日
應(yīng)用手冊 Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A) 1997年 8月 1日
應(yīng)用手冊 CMOS Power Consumption and CPD Calculation (Rev. B) 1997年 6月 1日
應(yīng)用手冊 Live Insertion 1996年 10月 1日

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封裝 引腳 CAD 符號、封裝和 3D 模型
SOIC (DW) 20 Ultra Librarian
TSSOP (PW) 20 Ultra Librarian

訂購和質(zhì)量

包含信息：
  • RoHS
  • REACH
  • 器件標(biāo)識
  • 引腳鍍層/焊球材料
  • MSL 等級/回流焊峰值溫度
  • MTBF/時基故障估算
  • 材料成分
  • 鑒定摘要
  • 持續(xù)可靠性監(jiān)測
包含信息：
  • 制造廠地點
  • 封裝廠地點

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