LP3892
- Ultra Low Dropout Voltage (140 mV at 1.5A typ)
- Low Ground Pin Current
- Load Regulation of 0.04%/A
- 60 nA Typical Quiescent Current in Shutdown
- 1.5% Output Accuracy (25°C)
- TO-220, DDPAK/TO-263 and SO PowerPAD-8 Packages
- Over Temperature/Over Current Protection
- ?40°C to +125°C Junction Temperature Range
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The LP3892 is a high current, fast response regulator which can maintain output voltage regulation with minimum input to output voltage drop. Fabricated on a CMOS process, the device operates from two input voltages: Vbias provides voltage to drive the gate of the N-MOS power transistor, while Vin is the input voltage which supplies power to the load. The use of an external bias rail allows the part to operate from ultra low Vin voltages. Unlike bipolar regulators, the CMOS architecture consumes extremely low quiescent current at any output load current. The use of an N-MOS power transistor results in wide bandwidth, yet minimum external capacitance is required to maintain loop stability.
The fast transient response of these devices makes them suitable for use in powering DSP, Microcontroller Core voltages and Switch Mode Power Supply post regulators. The parts are available in TO-220, DDPAK/TO-263 and SO PowerPAD-8 packages.
Dropout Voltage:140mV (typ) at 1.5A load current.
Ground Pin Current: 3 mA (typ) at full load.
Shutdown Current: 60 nA (typ) when S/D pin is low.
Precision Output Voltage: 1.5% room temperature accuracy.
技術文檔
| 類型 | 標題 | 下載最新的英語版本 | 日期 | |||
|---|---|---|---|---|---|---|
| * | 數據表 | LP3892 1.5A Fast-Response Ultra Low Dropout Linear Regulators 數據表 (Rev. D) | 2013年 4月 2日 |
設計和開發
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MLTLDO2EVM-037 — 用于 DCY、DDA 和 KVU 封裝的通用 LDO 線性穩壓器評估模塊
借助采用多種封裝選項的 MLTLDO2EVM-037 低壓降 (LDO) 評估模塊 (EVM),設計工程師能評估可能用于其自身電路應用的線性穩壓器采用多種常見封裝時的運行情況和性能。這種 EVM 配置包含一個 DDA、3 引腳和 5 引腳 KVU 以及 DCY 封裝,便于工程師焊接和評估部件。
| 封裝 | 引腳 | CAD 符號、封裝和 3D 模型 |
|---|---|---|
| HSOIC (DDA) | 8 | Ultra Librarian |
| TO-263 (KTT) | 5 | Ultra Librarian |
訂購和質量
- RoHS
- REACH
- 器件標識
- 引腳鍍層/焊球材料
- MSL 等級/回流焊峰值溫度
- MTBF/時基故障估算
- 材料成分
- 鑒定摘要
- 持續可靠性監測
- 制造廠地點
- 封裝廠地點
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